Flexible microdischarge arrays: Large scale fabrication and AC operation

Sung Jin Park, Kuo Feng Chen, James Gary Eden

Research output: Contribution to journalArticlepeer-review

Abstract

The fabrication of microdischarge arrays in metal/polymer/metal structures, which have a thickness of about 30-100μm, was investigated. The microcavities of 30-100μm in diameter were formed by laser microdrilling or a chemical etching process. To increase the device lifetime and emission uniformity, the electrodes were coated with one of the various thin film dielectrics to a thickness of about 1-4 μm. The voltage-current curve for the arrays exhibited a linear positive differential resistance and startup voltages of about 550-750 V p-p for an excitation frequency of 5-20 kHz AC. The results show that sealing of such flexible devices can be achieved by modified lamination technology and multi-layer coating method.

Original languageEnglish (US)
Article numberTuL3
Pages (from-to)254-255
Number of pages2
JournalConference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
Volume1
StatePublished - 2004

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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