Flexible microchannel heat exchanger

Mark A Shannon; Michael L. Philpott; John C. Selby

Flexible microchannel heat exchanger

Mark A Shannon (Inventor), Michael L. Philpott (Inventor), John C. Selby (Inventor)

Mechanical Science and Engineering

Research output: Patent

Abstract

A flexible mesoscopic heat exchanger is provided by the invention. The heat exchanger of the invention includes uniform microchannels for fluid flow. Separate header and channel layers include microchannels for fluid flow and heat exchange. A layered structure with channels aligned in multiple orientations in the layers permits the use of a flexible material without channel sagging and provides uniform flows. In a preferred embodiment, layers are heat sealed, e.g., by a preferred lamination fabrication process.

Original language	English (US)
U.S. patent number	6904966
Filing date	10/16/03
State	Published - Jun 14 2005

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title = "Flexible microchannel heat exchanger",

abstract = "A flexible mesoscopic heat exchanger is provided by the invention. The heat exchanger of the invention includes uniform microchannels for fluid flow. Separate header and channel layers include microchannels for fluid flow and heat exchange. A layered structure with channels aligned in multiple orientations in the layers permits the use of a flexible material without channel sagging and provides uniform flows. In a preferred embodiment, layers are heat sealed, e.g., by a preferred lamination fabrication process.",

author = "Shannon, {Mark A} and Philpott, {Michael L.} and Selby, {John C.}",

note = "STATEMENT OF GOVERNMENT INTEREST This invention was made with government support under Contract Number DABT63-97-C-0069 awarded by the Defense Advanced Research Project Agency (DARPA). The government has certain rights in this invention.; 6904966",

year = "2005",

month = jun,

day = "14",

language = "English (US)",

type = "Patent",

}

TY - PAT

T1 - Flexible microchannel heat exchanger

AU - Shannon, Mark A

AU - Philpott, Michael L.

AU - Selby, John C.

N1 - STATEMENT OF GOVERNMENT INTEREST This invention was made with government support under Contract Number DABT63-97-C-0069 awarded by the Defense Advanced Research Project Agency (DARPA). The government has certain rights in this invention.

PY - 2005/6/14

Y1 - 2005/6/14

N2 - A flexible mesoscopic heat exchanger is provided by the invention. The heat exchanger of the invention includes uniform microchannels for fluid flow. Separate header and channel layers include microchannels for fluid flow and heat exchange. A layered structure with channels aligned in multiple orientations in the layers permits the use of a flexible material without channel sagging and provides uniform flows. In a preferred embodiment, layers are heat sealed, e.g., by a preferred lamination fabrication process.

AB - A flexible mesoscopic heat exchanger is provided by the invention. The heat exchanger of the invention includes uniform microchannels for fluid flow. Separate header and channel layers include microchannels for fluid flow and heat exchange. A layered structure with channels aligned in multiple orientations in the layers permits the use of a flexible material without channel sagging and provides uniform flows. In a preferred embodiment, layers are heat sealed, e.g., by a preferred lamination fabrication process.

M3 - Patent

M1 - 6904966

Y2 - 2003/10/16

ER -

Flexible microchannel heat exchanger

Abstract

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