Flexible electronic devices from hot embossing material transfer

Allen Ashante', Andrew Cannon, William Paul King, Samuel Graham

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English (US)
Title of host publication	Proceedings of the 4th ASME Integrated Nanosystems Conference
Subtitle of host publication	Design, Synthesis, and Applications
Pages	75-76
Number of pages	2
State	Published - 2005
Externally published	Yes
Event	4th ASME Integrated Nanosystems Conference: Design, Synthesis, and Applications - Berkeley, CA, United States Duration: Sep 14 2005 → Sep 16 2005

Other	4th ASME Integrated Nanosystems Conference: Design, Synthesis, and Applications
Country/Territory	United States
City	Berkeley, CA
Period	9/14/05 → 9/16/05

ASJC Scopus subject areas

@inproceedings{58dc7d085e49420584cac4d7ab9e9a80,

title = "Flexible electronic devices from hot embossing material transfer",

author = "Allen Ashante' and Andrew Cannon and King, {William Paul} and Samuel Graham",

year = "2005",

language = "English (US)",

isbn = "0791842088",

pages = "75--76",

booktitle = "Proceedings of the 4th ASME Integrated Nanosystems Conference",

note = "4th ASME Integrated Nanosystems Conference: Design, Synthesis, and Applications ; Conference date: 14-09-2005 Through 16-09-2005",

}

TY - GEN

T1 - Flexible electronic devices from hot embossing material transfer

AU - Ashante', Allen

AU - Cannon, Andrew

AU - King, William Paul

AU - Graham, Samuel

PY - 2005

Y1 - 2005

UR - http://www.scopus.com/inward/record.url?scp=32844455190&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=32844455190&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:32844455190

SN - 0791842088

SP - 75

EP - 76

BT - Proceedings of the 4th ASME Integrated Nanosystems Conference

T2 - 4th ASME Integrated Nanosystems Conference: Design, Synthesis, and Applications

Y2 - 14 September 2005 through 16 September 2005

ER -