Finite-thickness conductor models for full-wave analysis of interconnects with the adaptive integral method

Jason Morsey, Vladimir Okhmatovski, Andreas C. Cangellaris

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Modeling methodologies are proposed for lossy conductors of finite thickness. The proposed models are such that neither the ease of implementation nor the computational efficiency of a fast adaptive integral equation method-based electromagnetic field solver is penalized.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging, EPEP 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages45-48
Number of pages4
ISBN (Electronic)0780374517
DOIs
StatePublished - 2002
Event11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002 - Monterey, United States
Duration: Oct 21 2002Oct 23 2002

Publication series

NameIEEE Topical Meeting on Electrical Performance of Electronic Packaging
Volume2002-January

Other

Other11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002
CountryUnited States
CityMonterey
Period10/21/0210/23/02

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

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