Modeling methodologies are proposed for lossy conductors of finite thickness. The proposed models are such that neither the ease of implementation nor the computational efficiency of a fast adaptive integral equation method-based electromagnetic field solver is penalized.
|Title of host publication
|Electrical Performance of Electronic Packaging, EPEP 2002
|Institute of Electrical and Electronics Engineers Inc.
|Number of pages
|Published - 2002
|11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002 - Monterey, United States
Duration: Oct 21 2002 → Oct 23 2002
|IEEE Topical Meeting on Electrical Performance of Electronic Packaging
|11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002
|10/21/02 → 10/23/02
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Condensed Matter Physics
- Electronic, Optical and Magnetic Materials