Finite ground plane packaging effects on a dual-band PIFA

Brian J. Herting, Alessandro Perrotta, Jennifer T. Bernhard

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A dual-band planar inverted-F antenna (PIFA) is proposed and the effects of packaging, i.e., the ground plane, on its operation are studied. A subsequent method for choosing the optimal ground plane dimensions is presented.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging, EPEP 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages95-98
Number of pages4
ISBN (Electronic)0780374517
DOIs
StatePublished - 2002
Event11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002 - Monterey, United States
Duration: Oct 21 2002Oct 23 2002

Publication series

NameIEEE Topical Meeting on Electrical Performance of Electronic Packaging
Volume2002-January

Other

Other11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002
Country/TerritoryUnited States
CityMonterey
Period10/21/0210/23/02

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

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