Finite ground plane packaging effects on a dual-band PIFA

Brian J. Herting; Alessandro Perrotta; Jennifer Truman Bernhard

doi:10.1109/EPEP.2002.1057891

Finite ground plane packaging effects on a dual-band PIFA

Brian J. Herting, Alessandro Perrotta, Jennifer Truman Bernhard

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A dual-band planar inverted-F antenna (PIFA) is proposed and the effects of packaging, i.e., the ground plane, on its operation are studied. A subsequent method for choosing the optimal ground plane dimensions is presented.

Original language	English (US)
Title of host publication	Electrical Performance of Electronic Packaging, EPEP 2002
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	95-98
Number of pages	4
Volume	2002-January
ISBN (Electronic)	0780374517
DOIs	https://doi.org/10.1109/EPEP.2002.1057891
State	Published - 2002
Event	11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002 - Monterey, United States Duration: Oct 21 2002 → Oct 23 2002

Other

Other	11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002
Country/Territory	United States
City	Monterey
Period	10/21/02 → 10/23/02

ASJC Scopus subject areas

Electrical and Electronic Engineering
Condensed Matter Physics
Electronic, Optical and Magnetic Materials

Online availability

10.1109/EPEP.2002.1057891

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Finite ground plane packaging effects on a dual-band PIFA. / Herting, Brian J.; Perrotta, Alessandro; Bernhard, Jennifer Truman.
Electrical Performance of Electronic Packaging, EPEP 2002. Vol. 2002-January Institute of Electrical and Electronics Engineers Inc., 2002. p. 95-98 1057891.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Herting, BJ, Perrotta, A & Bernhard, JT 2002, Finite ground plane packaging effects on a dual-band PIFA. in Electrical Performance of Electronic Packaging, EPEP 2002. vol. 2002-January, 1057891, Institute of Electrical and Electronics Engineers Inc., pp. 95-98, 11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002, Monterey, United States, 10/21/02. https://doi.org/10.1109/EPEP.2002.1057891

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ER -

Finite ground plane packaging effects on a dual-band PIFA

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