Finite-Difference Time-Domain Analysis of Pulse Propagation in Multichip Module Interconnects

Michael Gribbons; Andreas C. Cangellaris; John L. Prince

doi:10.1109/33.239877

Finite-Difference Time-Domain Analysis of Pulse Propagation in Multichip Module Interconnects

Michael Gribbons, Andreas C. Cangellaris, John L. Prince

Research output: Contribution to journal › Article › peer-review

Abstract

The application of the finite-difference time-domain (FDTD) method to the electromagnetic characterization of multichip-module (MCM) interconnects with perforated (mesh) reference planes is demonstrated. The limitations of the method in finding transmission line propagation characteristics (i.e., characteristic impedance Z0 and phase constant β) are investigated. An alternative approach for the characterization of MCM interconnects is suggested which exploits the capabilities of the FDTD method. This alternative approach uses the results from the FDTD method to extract a per unit length delay and an approximate impulse response of the system. These results can be used to identify the effects of the perforated reference plane on signal propagation. The validity of the TEM approximation for signal propagation in realistic MCM structures is also examined.

Original language	English (US)
Pages (from-to)	490-498
Number of pages	9
Journal	IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Volume	16
Issue number	5
DOIs	https://doi.org/10.1109/33.239877
State	Published - Aug 1993
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Engineering(all)
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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10.1109/33.239877

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@article{bc9a69dad58944c383061df4080597a4,

title = "Finite-Difference Time-Domain Analysis of Pulse Propagation in Multichip Module Interconnects",

abstract = "The application of the finite-difference time-domain (FDTD) method to the electromagnetic characterization of multichip-module (MCM) interconnects with perforated (mesh) reference planes is demonstrated. The limitations of the method in finding transmission line propagation characteristics (i.e., characteristic impedance Z0 and phase constant β) are investigated. An alternative approach for the characterization of MCM interconnects is suggested which exploits the capabilities of the FDTD method. This alternative approach uses the results from the FDTD method to extract a per unit length delay and an approximate impulse response of the system. These results can be used to identify the effects of the perforated reference plane on signal propagation. The validity of the TEM approximation for signal propagation in realistic MCM structures is also examined.",

author = "Michael Gribbons and Cangellaris, {Andreas C.} and Prince, {John L.}",

note = "Funding Information: Manuscript received April 1, 1993. This work was supported in part by the Semiconductor Research Corporation under Grant 90-MP-86. The authors are with the Center for Electronic Packaging Research, Department of Electrical and Computer Engineering, University of Arizona, Tucson, AZ 85721. IEEE Log Number 9210433.",

year = "1993",

month = aug,

doi = "10.1109/33.239877",

language = "English (US)",

volume = "16",

pages = "490--498",

journal = "IEEE Transactions on Components, Hybrids and Manufacturing Technology",

issn = "0148-6411",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "5",

}

TY - JOUR

T1 - Finite-Difference Time-Domain Analysis of Pulse Propagation in Multichip Module Interconnects

AU - Gribbons, Michael

AU - Cangellaris, Andreas C.

AU - Prince, John L.

N1 - Funding Information: Manuscript received April 1, 1993. This work was supported in part by the Semiconductor Research Corporation under Grant 90-MP-86. The authors are with the Center for Electronic Packaging Research, Department of Electrical and Computer Engineering, University of Arizona, Tucson, AZ 85721. IEEE Log Number 9210433.

PY - 1993/8

Y1 - 1993/8

N2 - The application of the finite-difference time-domain (FDTD) method to the electromagnetic characterization of multichip-module (MCM) interconnects with perforated (mesh) reference planes is demonstrated. The limitations of the method in finding transmission line propagation characteristics (i.e., characteristic impedance Z0 and phase constant β) are investigated. An alternative approach for the characterization of MCM interconnects is suggested which exploits the capabilities of the FDTD method. This alternative approach uses the results from the FDTD method to extract a per unit length delay and an approximate impulse response of the system. These results can be used to identify the effects of the perforated reference plane on signal propagation. The validity of the TEM approximation for signal propagation in realistic MCM structures is also examined.

AB - The application of the finite-difference time-domain (FDTD) method to the electromagnetic characterization of multichip-module (MCM) interconnects with perforated (mesh) reference planes is demonstrated. The limitations of the method in finding transmission line propagation characteristics (i.e., characteristic impedance Z0 and phase constant β) are investigated. An alternative approach for the characterization of MCM interconnects is suggested which exploits the capabilities of the FDTD method. This alternative approach uses the results from the FDTD method to extract a per unit length delay and an approximate impulse response of the system. These results can be used to identify the effects of the perforated reference plane on signal propagation. The validity of the TEM approximation for signal propagation in realistic MCM structures is also examined.

UR - http://www.scopus.com/inward/record.url?scp=0027643774&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0027643774&partnerID=8YFLogxK

U2 - 10.1109/33.239877

DO - 10.1109/33.239877

M3 - Article

AN - SCOPUS:0027643774

SN - 0148-6411

VL - 16

SP - 490

EP - 498

JO - IEEE Transactions on Components, Hybrids and Manufacturing Technology

JF - IEEE Transactions on Components, Hybrids and Manufacturing Technology

IS - 5

ER -

Finite-Difference Time-Domain Analysis of Pulse Propagation in Multichip Module Interconnects

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