Keyphrases
3D Modeling
28%
3D Simulation
28%
Base Plate
14%
Ceramic Resistor
14%
Chip Temperature
42%
Computational Intensity
14%
Conventional Counterpart
14%
Conventional Design
28%
Density Field
28%
Design Topology
100%
Device Temperature
14%
Direct Cooling
100%
Experimental Testing
14%
Fin Design
100%
Finning
14%
Flow Condition
14%
Flow Direction
28%
Heat Transfer Coefficient
28%
High Heat Flux Removal
14%
In(III)
14%
Laminar Regime
14%
Low Pressure Drop
14%
Multi-chip Power Module
100%
Optimal Fin Design
14%
Performance Improvement
14%
Pin Fin
14%
Power Semiconductor Devices
14%
Pressure Drop
28%
Pumping Power
14%
Straight Fins
42%
Surface Shape
14%
Temperature Drop
14%
Thermal Resistance
14%
Thermal-hydraulic Performance
14%
Topology Optimization
100%
Turbulent Flow Regime
14%
Zigzag
14%
Engineering
Baseplate
20%
Design Optimization
100%
Flow Condition
20%
Flow Direction
40%
Flow Rate
20%
Flow Regime
40%
Heat Flux
20%
Heat Transfer Coefficient
40%
Inflow Rate
20%
Laminar Flows
20%
Liquid Cooling
100%
Performance Improvement
20%
Pressure Drop
60%
Pumping Power
20%
Semiconductor Device
20%
Shape Surface
20%
Temperature Drop
20%
Thermal Hydraulics
20%
Thermal Resistance
20%
Turbulent Flow
20%