FFT-based macromodeling of power delivery network with uncertainties using Latency Insertion Method and stochastic collocation

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, we make use of the Latency Insertion Method, a time domain circuit solver, to generate a frequency domain macromodel for a power delivery network with uncertainties. Using Stochastic Collocation, we are able to significantly reduce computation time over Monte Carlo while achieving comparable statistical results. The advantage of using the Latency Insertion Method is that its computational complexity scales linearly with circuit size, allowing it to become more efficient as circuit size grows.

Original languageEnglish (US)
Title of host publication2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-3
Number of pages3
ISBN (Electronic)9781538612385
DOIs
StatePublished - Jan 20 2018
Event2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 - Haining, Zhejiang, China
Duration: Dec 14 2017Dec 16 2017

Publication series

Name2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
Volume2018-January

Other

Other2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
CountryChina
CityHaining, Zhejiang
Period12/14/1712/16/17

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

Cite this

Kummerer, R. F., Chen, X., Schutt-Aine, J. E., & Cangellaris, A. C. (2018). FFT-based macromodeling of power delivery network with uncertainties using Latency Insertion Method and stochastic collocation. In 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 (pp. 1-3). (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017; Vol. 2018-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDAPS.2017.8277043