Feature-less Stitching of Cylindrical Tunnel

Ramanpreet Singh Pahwa, Wei Kiat Leong, Shaohui Foong, Karianto Leman, Minh N Do

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Traditional image stitching algorithms use transforms such as homography to combine different views of a scene. They usually work well when the scene is planar or when the camera is only rotated, keeping its position static. This severely limits their use in real world scenarios where an unmanned aerial vehicle (UAV) potentially hovers around and flies in an enclosed area while rotating to capture a video sequence. We utilize known scene geometry along with recorded camera trajectory to create cylindrical images captured in a given environment such as a tunnel where the camera rotates around its center. The captured images of the inner surface of the given scene are combined to create a composite panoramic image that is textured onto a 3D geometrical object in Unity graphical engine to create an immersive environment for end users.

Original languageEnglish (US)
Title of host publicationProceedings - 17th IEEE/ACIS International Conference on Computer and Information Science, ICIS 2018
EditorsWei Xiong, Wenqiang Shang, Simon Xu, Hwee-Kuan Lee
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages502-507
Number of pages6
ISBN (Electronic)9781538658925
DOIs
StatePublished - Sep 14 2018
Event17th IEEE/ACIS International Conference on Computer and Information Science, ICIS 2018 - Singapore, Singapore
Duration: Jun 6 2018Jun 8 2018

Other

Other17th IEEE/ACIS International Conference on Computer and Information Science, ICIS 2018
CountrySingapore
CitySingapore
Period6/6/186/8/18

Fingerprint

Tunnels
Cameras
Unmanned aerial vehicles (UAV)
Trajectories
Engines
Geometry
Composite materials

Keywords

  • Cylindrical Projection
  • Image Stitching
  • Unity Simulation

ASJC Scopus subject areas

  • Artificial Intelligence
  • Computer Networks and Communications
  • Information Systems
  • Media Technology

Cite this

Pahwa, R. S., Kiat Leong, W., Foong, S., Leman, K., & Do, M. N. (2018). Feature-less Stitching of Cylindrical Tunnel. In W. Xiong, W. Shang, S. Xu, & H-K. Lee (Eds.), Proceedings - 17th IEEE/ACIS International Conference on Computer and Information Science, ICIS 2018 (pp. 502-507). [8466434] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICIS.2018.8466434

Feature-less Stitching of Cylindrical Tunnel. / Pahwa, Ramanpreet Singh; Kiat Leong, Wei; Foong, Shaohui; Leman, Karianto; Do, Minh N.

Proceedings - 17th IEEE/ACIS International Conference on Computer and Information Science, ICIS 2018. ed. / Wei Xiong; Wenqiang Shang; Simon Xu; Hwee-Kuan Lee. Institute of Electrical and Electronics Engineers Inc., 2018. p. 502-507 8466434.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Pahwa, RS, Kiat Leong, W, Foong, S, Leman, K & Do, MN 2018, Feature-less Stitching of Cylindrical Tunnel. in W Xiong, W Shang, S Xu & H-K Lee (eds), Proceedings - 17th IEEE/ACIS International Conference on Computer and Information Science, ICIS 2018., 8466434, Institute of Electrical and Electronics Engineers Inc., pp. 502-507, 17th IEEE/ACIS International Conference on Computer and Information Science, ICIS 2018, Singapore, Singapore, 6/6/18. https://doi.org/10.1109/ICIS.2018.8466434
Pahwa RS, Kiat Leong W, Foong S, Leman K, Do MN. Feature-less Stitching of Cylindrical Tunnel. In Xiong W, Shang W, Xu S, Lee H-K, editors, Proceedings - 17th IEEE/ACIS International Conference on Computer and Information Science, ICIS 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 502-507. 8466434 https://doi.org/10.1109/ICIS.2018.8466434
Pahwa, Ramanpreet Singh ; Kiat Leong, Wei ; Foong, Shaohui ; Leman, Karianto ; Do, Minh N. / Feature-less Stitching of Cylindrical Tunnel. Proceedings - 17th IEEE/ACIS International Conference on Computer and Information Science, ICIS 2018. editor / Wei Xiong ; Wenqiang Shang ; Simon Xu ; Hwee-Kuan Lee. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 502-507
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