Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces

Q. S. Zhu, Z. F. Zhang, J. K. Shang, Z. G. Wang

Research output: Contribution to journalArticlepeer-review

Abstract

Sn-Ag-Cu solder/copper single crystal joints were prepared to reveal the interfacial fatigue damage mechanisms. Scallop-type Cu6Sn5 and planar-type Cu6Sn5/Cu3Sn intermetallic compounds (IMCs) interfaces were formed between SnAgCu solder and copper single crystal after re-flowing at 240 °C and subsequent aging at 170 °C, respectively. Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the SnAgCu solder/copper single crystal joint. Two types of fatigue cracking modes, i.e. interfacial cracking between solder and IMC and fracture within IMC, were observed. Based on the experimental observations above, the corresponding interfacial fatigue cracking mechanisms were discussed.

Original languageEnglish (US)
Pages (from-to)588-594
Number of pages7
JournalMaterials Science and Engineering A
Volume435-436
DOIs
StatePublished - Nov 5 2006

Keywords

  • Copper single crystal
  • Cyclic deformation
  • Fatigue cracking
  • Interface
  • Intermetallic compounds (IMCs)
  • Persistent slip bands (PSBs)
  • Sn-Ag-Cu solder

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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