Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces

Q. S. Zhu; Z. F. Zhang; J. K. Shang; Z. G. Wang

doi:10.1016/j.msea.2006.07.100

Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces

Q. S. Zhu, Z. F. Zhang, J. K. Shang, Z. G. Wang

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

Sn-Ag-Cu solder/copper single crystal joints were prepared to reveal the interfacial fatigue damage mechanisms. Scallop-type Cu₆Sn₅ and planar-type Cu₆Sn₅/Cu₃Sn intermetallic compounds (IMCs) interfaces were formed between SnAgCu solder and copper single crystal after re-flowing at 240 °C and subsequent aging at 170 °C, respectively. Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the SnAgCu solder/copper single crystal joint. Two types of fatigue cracking modes, i.e. interfacial cracking between solder and IMC and fracture within IMC, were observed. Based on the experimental observations above, the corresponding interfacial fatigue cracking mechanisms were discussed.

Original language	English (US)
Pages (from-to)	588-594
Number of pages	7
Journal	Materials Science and Engineering A
Volume	435-436
DOIs	https://doi.org/10.1016/j.msea.2006.07.100
State	Published - Nov 5 2006

Keywords

Copper single crystal
Cyclic deformation
Fatigue cracking
Interface
Intermetallic compounds (IMCs)
Persistent slip bands (PSBs)
Sn-Ag-Cu solder

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Online availability

10.1016/j.msea.2006.07.100

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title = "Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces",

abstract = "Sn-Ag-Cu solder/copper single crystal joints were prepared to reveal the interfacial fatigue damage mechanisms. Scallop-type Cu6Sn5 and planar-type Cu6Sn5/Cu3Sn intermetallic compounds (IMCs) interfaces were formed between SnAgCu solder and copper single crystal after re-flowing at 240 °C and subsequent aging at 170 °C, respectively. Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the SnAgCu solder/copper single crystal joint. Two types of fatigue cracking modes, i.e. interfacial cracking between solder and IMC and fracture within IMC, were observed. Based on the experimental observations above, the corresponding interfacial fatigue cracking mechanisms were discussed.",

keywords = "Copper single crystal, Cyclic deformation, Fatigue cracking, Interface, Intermetallic compounds (IMCs), Persistent slip bands (PSBs), Sn-Ag-Cu solder",

author = "Zhu, {Q. S.} and Zhang, {Z. F.} and Shang, {J. K.} and Wang, {Z. G.}",

note = "Funding Information: The authors would like to thank J.Y. Min, W. Gao, H.H. Su, J.L. Wen, and G. Yao for sample preparation, mechanical tests and SEM observations. This work was financially supported by National Basic Research Program of China under grant no. 2004CB619306, and the National Natural Science Foundation of China (NSFC) under grant Nos. 50571104 and 50625241. Copyright: Copyright 2008 Elsevier B.V., All rights reserved.",

year = "2006",

month = nov,

day = "5",

doi = "10.1016/j.msea.2006.07.100",

language = "English (US)",

volume = "435-436",

pages = "588--594",

journal = "Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing",

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AU - Zhu, Q. S.

AU - Zhang, Z. F.

AU - Shang, J. K.

AU - Wang, Z. G.

N1 - Funding Information: The authors would like to thank J.Y. Min, W. Gao, H.H. Su, J.L. Wen, and G. Yao for sample preparation, mechanical tests and SEM observations. This work was financially supported by National Basic Research Program of China under grant no. 2004CB619306, and the National Natural Science Foundation of China (NSFC) under grant Nos. 50571104 and 50625241. Copyright: Copyright 2008 Elsevier B.V., All rights reserved.

PY - 2006/11/5

Y1 - 2006/11/5

N2 - Sn-Ag-Cu solder/copper single crystal joints were prepared to reveal the interfacial fatigue damage mechanisms. Scallop-type Cu6Sn5 and planar-type Cu6Sn5/Cu3Sn intermetallic compounds (IMCs) interfaces were formed between SnAgCu solder and copper single crystal after re-flowing at 240 °C and subsequent aging at 170 °C, respectively. Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the SnAgCu solder/copper single crystal joint. Two types of fatigue cracking modes, i.e. interfacial cracking between solder and IMC and fracture within IMC, were observed. Based on the experimental observations above, the corresponding interfacial fatigue cracking mechanisms were discussed.

AB - Sn-Ag-Cu solder/copper single crystal joints were prepared to reveal the interfacial fatigue damage mechanisms. Scallop-type Cu6Sn5 and planar-type Cu6Sn5/Cu3Sn intermetallic compounds (IMCs) interfaces were formed between SnAgCu solder and copper single crystal after re-flowing at 240 °C and subsequent aging at 170 °C, respectively. Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the SnAgCu solder/copper single crystal joint. Two types of fatigue cracking modes, i.e. interfacial cracking between solder and IMC and fracture within IMC, were observed. Based on the experimental observations above, the corresponding interfacial fatigue cracking mechanisms were discussed.

KW - Copper single crystal

KW - Cyclic deformation

KW - Fatigue cracking

KW - Interface

KW - Intermetallic compounds (IMCs)

KW - Persistent slip bands (PSBs)

KW - Sn-Ag-Cu solder

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ER -

Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces

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Keywords

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