Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern

Wei Liu; Lei Zhang; K. J. Hsia; J. K. Shang

doi:10.1016/S1005-0302(11)60015-7

Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern

Wei Liu, Lei Zhang, K. J. Hsia, J. K. Shang

Research output: Contribution to journal › Article › peer-review

Abstract

The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere (H₂ 5%+Ar 95%). Liquid solder spreading was observed to follow the wheel pattern made of Au/Cu thin film. At the center, a liquid cap was formed around the hub by viscous spreading of the liquid front. Ahead of the main viscous flow front, a liquid film was found to be extended on thin Au-Cu lines at a fast rate to a great distance by rapid Sn-Au chemical reaction.

Original language	English (US)
Pages (from-to)	1143-1147
Number of pages	5
Journal	Journal of Materials Science and Technology
Volume	26
Issue number	12
DOIs	https://doi.org/10.1016/S1005-0302(11)60015-7
State	Published - Dec 2010
Externally published	Yes

Keywords

Liquid film
Reactive wetting
Solder
Spreading
Thin film pattern
Wetting

ASJC Scopus subject areas

Ceramics and Composites
Polymers and Plastics
Metals and Alloys
Materials Chemistry
Mechanics of Materials
Mechanical Engineering

Online availability

10.1016/S1005-0302(11)60015-7

Library availability

Discover UIUC Full Text

Cite this

@article{e8eb29a3992a4ff4bdd7e17380f39f51,

title = "Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern",

abstract = "The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere (H2 5%+Ar 95%). Liquid solder spreading was observed to follow the wheel pattern made of Au/Cu thin film. At the center, a liquid cap was formed around the hub by viscous spreading of the liquid front. Ahead of the main viscous flow front, a liquid film was found to be extended on thin Au-Cu lines at a fast rate to a great distance by rapid Sn-Au chemical reaction.",

keywords = "Liquid film, Reactive wetting, Solder, Spreading, Thin film pattern, Wetting",

author = "Wei Liu and Lei Zhang and Hsia, {K. J.} and Shang, {J. K.}",

note = "Funding Information: This study was supported by the National Natural Science Foundation of China (No. 50501022) and the National Basic Research Program of China (No. 2004CB619306). The authors appreciate the helpful discussion with Prof. Z.G. Wang and experimental assistance of John P. Daghfal.",

year = "2010",

month = dec,

doi = "10.1016/S1005-0302(11)60015-7",

language = "English (US)",

volume = "26",

pages = "1143--1147",

journal = "Journal of Materials Science and Technology",

issn = "1005-0302",

publisher = "Chinese Society of Metals",

number = "12",

}

TY - JOUR

T1 - Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern

AU - Liu, Wei

AU - Zhang, Lei

AU - Hsia, K. J.

AU - Shang, J. K.

N1 - Funding Information: This study was supported by the National Natural Science Foundation of China (No. 50501022) and the National Basic Research Program of China (No. 2004CB619306). The authors appreciate the helpful discussion with Prof. Z.G. Wang and experimental assistance of John P. Daghfal.

PY - 2010/12

Y1 - 2010/12

N2 - The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere (H2 5%+Ar 95%). Liquid solder spreading was observed to follow the wheel pattern made of Au/Cu thin film. At the center, a liquid cap was formed around the hub by viscous spreading of the liquid front. Ahead of the main viscous flow front, a liquid film was found to be extended on thin Au-Cu lines at a fast rate to a great distance by rapid Sn-Au chemical reaction.

AB - The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere (H2 5%+Ar 95%). Liquid solder spreading was observed to follow the wheel pattern made of Au/Cu thin film. At the center, a liquid cap was formed around the hub by viscous spreading of the liquid front. Ahead of the main viscous flow front, a liquid film was found to be extended on thin Au-Cu lines at a fast rate to a great distance by rapid Sn-Au chemical reaction.

KW - Liquid film

KW - Reactive wetting

KW - Solder

KW - Spreading

KW - Thin film pattern

KW - Wetting

UR - http://www.scopus.com/inward/record.url?scp=78751608184&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78751608184&partnerID=8YFLogxK

U2 - 10.1016/S1005-0302(11)60015-7

DO - 10.1016/S1005-0302(11)60015-7

M3 - Article

AN - SCOPUS:78751608184

SN - 1005-0302

VL - 26

SP - 1143

EP - 1147

JO - Journal of Materials Science and Technology

JF - Journal of Materials Science and Technology

IS - 12

ER -

Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern

Abstract

Keywords

ASJC Scopus subject areas

Online availability

Library availability

Related links

Fingerprint

Cite this