Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern

Wei Liu, Lei Zhang, K. J. Hsia, J. K. Shang

Research output: Contribution to journalArticlepeer-review

Abstract

The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere (H2 5%+Ar 95%). Liquid solder spreading was observed to follow the wheel pattern made of Au/Cu thin film. At the center, a liquid cap was formed around the hub by viscous spreading of the liquid front. Ahead of the main viscous flow front, a liquid film was found to be extended on thin Au-Cu lines at a fast rate to a great distance by rapid Sn-Au chemical reaction.

Original languageEnglish (US)
Pages (from-to)1143-1147
Number of pages5
JournalJournal of Materials Science and Technology
Volume26
Issue number12
DOIs
StatePublished - Dec 2010

Keywords

  • Liquid film
  • Reactive wetting
  • Solder
  • Spreading
  • Thin film pattern
  • Wetting

ASJC Scopus subject areas

  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys
  • Materials Chemistry
  • Mechanics of Materials
  • Mechanical Engineering

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