TY - GEN
T1 - Fast macromodeling technique of sampled time/frequency data using z-domain vector-fitting method
AU - Mekonnen, Yidnek S.
AU - Schutt-Ainé, José E.
PY - 2007
Y1 - 2007
N2 - The vector-fitting algorithm has been used as the main macromodeling tool for approximating frequency domain responses of complex interconnects and electrical packages [5]. In this paper, a new methodology is proposed to fit transfer functions of frequency or time response data obtained from numerical electromagnetic simulation or measured frequency-domain or time-domain response data. This new method, z-domain vector-fitting (ZDVF), is a formulation of vector-fitting method in the z domain; it has an advantage of faster convergence and better numerical stability compared to the s-domain vector-fitting method(VF). The fast convergence of the method reduces the overall macromodel generation time. The accuracy, numerical stability and convergence speed of VF and ZDVF are compared. Examples are provided to demonstrate the advantage of the ZDVF.
AB - The vector-fitting algorithm has been used as the main macromodeling tool for approximating frequency domain responses of complex interconnects and electrical packages [5]. In this paper, a new methodology is proposed to fit transfer functions of frequency or time response data obtained from numerical electromagnetic simulation or measured frequency-domain or time-domain response data. This new method, z-domain vector-fitting (ZDVF), is a formulation of vector-fitting method in the z domain; it has an advantage of faster convergence and better numerical stability compared to the s-domain vector-fitting method(VF). The fast convergence of the method reduces the overall macromodel generation time. The accuracy, numerical stability and convergence speed of VF and ZDVF are compared. Examples are provided to demonstrate the advantage of the ZDVF.
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U2 - 10.1109/EPEP.2007.4387120
DO - 10.1109/EPEP.2007.4387120
M3 - Conference contribution
AN - SCOPUS:47949128484
SN - 1424408830
SN - 9781424408832
T3 - IEEE Topical Meeting on Electrical Performance of Electronic Packaging
SP - 47
EP - 50
BT - IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP
T2 - IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP
Y2 - 29 October 2007 through 31 October 2007
ER -