Fast dummy-fill density analysis with coupling constraints

Hua Xiang, Liang Deng, Ruchir Puri, Kai Yuan Chao, Martin D.F. Wong

Research output: Contribution to journalArticlepeer-review

Abstract

In modern very large scale integration manufacturing processes, dummy fills are widely used to adjust local metal density in order to improve layout uniformity and yield optimization. However, the introduction of a large amount of dummy features also affects wire electrical properties. In this paper, we propose the first Coupling-constrained Dummy-Fill analysis algorithm which identifies feasible locations for dummy fills such that the fill-induced coupling capacitance can be bounded within the given coupling threshold of each wire segment. A speedup approach is presented based on the cache concept. The algorithm also makes efforts to maximize ground dummy fills, which are more robust and predictable. The output of the algorithm can be treated as the upper bound for dummy-fill insertion, and it can be easily adopted in density models to guide dummy-fill insertion without disturbing the existing design.

Original languageEnglish (US)
Article number4475260
Pages (from-to)633-642
Number of pages10
JournalIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume27
Issue number4
DOIs
StatePublished - Apr 1 2008

Keywords

  • Chemical mechanical planarization (CMP)
  • Coupling
  • Dummy fills

ASJC Scopus subject areas

  • Software
  • Computer Graphics and Computer-Aided Design
  • Electrical and Electronic Engineering

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