Fast calculation of electromagnetic interference by through-silicon vias

Aosheng Rong; Andreas C. Cangellaris; Feng Ling

doi:10.1109/ECTC.2014.6897591

Fast calculation of electromagnetic interference by through-silicon vias

Aosheng Rong, Andreas C. Cangellaris, Feng Ling

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A methodology is presented for the expedient calculation of radiated electromagnetic interference by dense arrays of through-silicon vias in layered substrates. The proposed methodology builds upon the efficiency of the Foldy-Lax scheme for the fast calculation of the electromagnetic interactions between multiple vias in planar substrates, by exploiting translation invariant expressions of the governing equations that lend themselves to fast calculation of the convolution integrals for the radiated fields using Fast Fourier Transform. Applications of the developed model and algorithm involving the investigation of radiated emissions from through-silicon via clusters are used to demonstrate the efficiency of the proposed algorithm.

Original language	English (US)
Title of host publication	Proceedings - Electronic Components and Technology Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	2094-2098
Number of pages	5
ISBN (Electronic)	9781479924073
DOIs	https://doi.org/10.1109/ECTC.2014.6897591
State	Published - Sep 11 2014
Event	64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States Duration: May 27 2014 → May 30 2014

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Other

Other	64th Electronic Components and Technology Conference, ECTC 2014
Country/Territory	United States
City	Orlando
Period	5/27/14 → 5/30/14

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Online availability

10.1109/ECTC.2014.6897591

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Rong, A., Cangellaris, A. C., & Ling, F. (2014). Fast calculation of electromagnetic interference by through-silicon vias. In Proceedings - Electronic Components and Technology Conference (pp. 2094-2098). [6897591] (Proceedings - Electronic Components and Technology Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2014.6897591

Fast calculation of electromagnetic interference by through-silicon vias. / Rong, Aosheng; Cangellaris, Andreas C.; Ling, Feng.

Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2014. p. 2094-2098 6897591 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Rong, A, Cangellaris, AC & Ling, F 2014, Fast calculation of electromagnetic interference by through-silicon vias. in Proceedings - Electronic Components and Technology Conference., 6897591, Proceedings - Electronic Components and Technology Conference, Institute of Electrical and Electronics Engineers Inc., pp. 2094-2098, 64th Electronic Components and Technology Conference, ECTC 2014, Orlando, United States, 5/27/14. https://doi.org/10.1109/ECTC.2014.6897591

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N2 - A methodology is presented for the expedient calculation of radiated electromagnetic interference by dense arrays of through-silicon vias in layered substrates. The proposed methodology builds upon the efficiency of the Foldy-Lax scheme for the fast calculation of the electromagnetic interactions between multiple vias in planar substrates, by exploiting translation invariant expressions of the governing equations that lend themselves to fast calculation of the convolution integrals for the radiated fields using Fast Fourier Transform. Applications of the developed model and algorithm involving the investigation of radiated emissions from through-silicon via clusters are used to demonstrate the efficiency of the proposed algorithm.

AB - A methodology is presented for the expedient calculation of radiated electromagnetic interference by dense arrays of through-silicon vias in layered substrates. The proposed methodology builds upon the efficiency of the Foldy-Lax scheme for the fast calculation of the electromagnetic interactions between multiple vias in planar substrates, by exploiting translation invariant expressions of the governing equations that lend themselves to fast calculation of the convolution integrals for the radiated fields using Fast Fourier Transform. Applications of the developed model and algorithm involving the investigation of radiated emissions from through-silicon via clusters are used to demonstrate the efficiency of the proposed algorithm.

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Fast calculation of electromagnetic interference by through-silicon vias

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