Fast calculation of electromagnetic interference by through-silicon vias

Aosheng Rong, Andreas C Cangellaris, Feng Ling

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A methodology is presented for the expedient calculation of radiated electromagnetic interference by dense arrays of through-silicon vias in layered substrates. The proposed methodology builds upon the efficiency of the Foldy-Lax scheme for the fast calculation of the electromagnetic interactions between multiple vias in planar substrates, by exploiting translation invariant expressions of the governing equations that lend themselves to fast calculation of the convolution integrals for the radiated fields using Fast Fourier Transform. Applications of the developed model and algorithm involving the investigation of radiated emissions from through-silicon via clusters are used to demonstrate the efficiency of the proposed algorithm.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2094-2098
Number of pages5
ISBN (Electronic)9781479924073
DOIs
StatePublished - Sep 11 2014
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States
Duration: May 27 2014May 30 2014

Other

Other64th Electronic Components and Technology Conference, ECTC 2014
CountryUnited States
CityOrlando
Period5/27/145/30/14

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Rong, A., Cangellaris, A. C., & Ling, F. (2014). Fast calculation of electromagnetic interference by through-silicon vias. In Proceedings - Electronic Components and Technology Conference (pp. 2094-2098). [6897591] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2014.6897591