Fast assessment of the impact of surrounding wiring on the transmission properties of high-speed interconnect channels

Joon Hyung Chung, Andreas C Cangellaris

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A methodology is proposed for the fast assessment of the impact of electromagnetic loading by surrounding wiring on the signal transmission properties of a high-speed interconnect channel. The proposed methodology is aimed at alleviating the computational complexity of the electromagnetic modeling of the channel including the details of the wiring in its surrounding that, more often than not and especially in the early stages of design, are not well defined and thus are best accounted for through a Monte Carlo analysis. Instead, use of a stochastic macromodel for the channel is proposed that incorporates the electromagnetic attributes of the surrounding wiring through a statistical description of its loading on the interconnects of the channel. The proposed method makes use of parametric rational interpolation to develop a frequency-dependent macromodel that is valid over the multi-dimensional space that describes the uncertainty of the neighboring layout topography. Making use of stochastic collocation, the channel macromodel lends itself to fast quantitative analysis of the channel transmission properties and signal degradation in both frequency and time domain. A simple channel example, which allows us to assess the accuracy of the proposed method, is used to demonstrate the key attributes of the proposed method and comment on its usefulness as a computer-aided tool for noise-aware wiring layout planning.

Original languageEnglish (US)
Title of host publication2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
Pages69-72
Number of pages4
DOIs
StatePublished - Dec 1 2012
Event2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 - Tempe, AZ, United States
Duration: Oct 21 2012Oct 24 2012

Publication series

Name2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012

Other

Other2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
CountryUnited States
CityTempe, AZ
Period10/21/1210/24/12

Keywords

  • electromagnetic loading
  • high-speed channel
  • layout uncertainty
  • multiconductor interconnects
  • rational function interpolation
  • signal integrity
  • stochastic modeling
  • transient simulation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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