@inproceedings{8ea05611b9e14490a0e24fb747144ee2,
title = "Fast and accurate multiscale electromagnetic modeling framework: An overview",
abstract = "We present an overview of challenge problems in electromagnetic modeling of highly complex and multi-scale structures found in 3D IC, SiP, SoC, and electronic packaging necessary for signal integrity assessment.",
keywords = "3D IC, SiP, SoP, accurate, electromagnetics, fast, modeling, multiscale, signal integrity",
author = "Chew, {W. C.} and Cangellaris, {A. C.} and J. Schutt-Aine and H. Braunisch and Qian, {Z. G.} and Aydiner, {A. A.} and K. Aygun and Jiang, {L. J.} and Ma, {Z. H.} and Meng, {L. L.} and M. Naeem",
year = "2013",
doi = "10.1109/SaPIW.2013.6558315",
language = "English (US)",
isbn = "9781467356787",
series = "2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013",
booktitle = "2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013",
note = "2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013 ; Conference date: 12-05-2013 Through 15-05-2013",
}