Fast and accurate multiscale electromagnetic modeling framework: An overview

Weng Cho Chew, Andreas C Cangellaris, Jose E Schutt-Aine, H. Braunisch, Z. G. Qian, A. A. Aydiner, K. Aygun, L. J. Jiang, Z. H. Ma, L. L. Meng, M. Naeem

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present an overview of challenge problems in electromagnetic modeling of highly complex and multi-scale structures found in 3D IC, SiP, SoC, and electronic packaging necessary for signal integrity assessment.

Original languageEnglish (US)
Title of host publication2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013
DOIs
StatePublished - Aug 20 2013
Event2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013 - Paris, France
Duration: May 12 2013May 15 2013

Publication series

Name2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013

Other

Other2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013
CountryFrance
CityParis
Period5/12/135/15/13

Keywords

  • 3D IC
  • SiP
  • SoP
  • accurate
  • electromagnetics
  • fast
  • modeling
  • multiscale
  • signal integrity

ASJC Scopus subject areas

  • Signal Processing

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  • Cite this

    Chew, W. C., Cangellaris, A. C., Schutt-Aine, J. E., Braunisch, H., Qian, Z. G., Aydiner, A. A., Aygun, K., Jiang, L. J., Ma, Z. H., Meng, L. L., & Naeem, M. (2013). Fast and accurate multiscale electromagnetic modeling framework: An overview. In 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013 [6558315] (2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013). https://doi.org/10.1109/SaPIW.2013.6558315