Fast and Accurate Current Prediction in Packages Using Neural Networks

Yanan Liu, Tianjian Lu, Jin Y. Kim, Ken Wu, Jian Ming Jin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electromigration (EM) has become one major reliability concern in modern integrated circuit (IC) packages. EM is caused by large currents flowing in metals and the resulting mean time to failure (MTTF) is highly dependent on the maximum current value. We here propose a scheme for fast and accurate prediction of the maximum current on the ball grid arrays (BGAs) in a package given the pin current information of the die. The proposed scheme uses neural networks to learn the resistance network of the package and achieve the non-linear current mapping. The fast prediction tool can be used for analysis and design exploration of the pin assignment on the die level.

Original languageEnglish (US)
Title of host publication2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages621-624
Number of pages4
ISBN (Electronic)9781538691991
DOIs
StatePublished - Jul 2019
Event2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 - New Orleans, United States
Duration: Jul 22 2019Jul 26 2019

Publication series

Name2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019

Conference

Conference2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
CountryUnited States
CityNew Orleans
Period7/22/197/26/19

Keywords

  • BGA
  • Black's equation
  • Electromigration
  • MTTF
  • machine learning
  • neural networks
  • packages

ASJC Scopus subject areas

  • Signal Processing
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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  • Cite this

    Liu, Y., Lu, T., Kim, J. Y., Wu, K., & Jin, J. M. (2019). Fast and Accurate Current Prediction in Packages Using Neural Networks. In 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 (pp. 621-624). [8825314] (2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISEMC.2019.8825314