TY - GEN
T1 - Fast analysis of the impact of interconnect routing variability on signal degradation
AU - Ochoa, Juan S.
AU - Cangellaris, Andreas C.
PY - 2012
Y1 - 2012
N2 - A computer model is proposed for the fast predictive analysis of the impact of interconnect routing variability on their broadband signal transmission properties. Through the use of a multi-conductor transmission line model of the interconnect structure and rational function interpolation in the frequency domain, the proposed model propagates routing variability described in terms of a set of properly defined random variables to broadband, stochastic scattering parameters for the transmission channel. In this manner, an efficient Monte Carlo analysis can be performed for the prediction of the statistics of the transient response of the channel due to routing uncertainty.
AB - A computer model is proposed for the fast predictive analysis of the impact of interconnect routing variability on their broadband signal transmission properties. Through the use of a multi-conductor transmission line model of the interconnect structure and rational function interpolation in the frequency domain, the proposed model propagates routing variability described in terms of a set of properly defined random variables to broadband, stochastic scattering parameters for the transmission channel. In this manner, an efficient Monte Carlo analysis can be performed for the prediction of the statistics of the transient response of the channel due to routing uncertainty.
UR - https://www.scopus.com/pages/publications/84874476134
UR - https://www.scopus.com/pages/publications/84874476134#tab=citedBy
U2 - 10.1109/EPEPS.2012.6457905
DO - 10.1109/EPEPS.2012.6457905
M3 - Conference contribution
AN - SCOPUS:84874476134
SN - 9781467325394
T3 - 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
SP - 315
EP - 318
BT - 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
T2 - 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
Y2 - 21 October 2012 through 24 October 2012
ER -