Failure of chip sized packaging (CSP) under coupling fields of electrical current and thermal cycle

F. Gao, Q. S. Zhu, K. Zheng, Z. Q. Liu, J. D. Guo, L. Zhang, J. K. Shang

Research output: Contribution to conferencePaperpeer-review

Abstract

In this work, we investigated the failure behavior of a commercial chip size packaging (CSP) under coupling fields of electrical current and thermal cycles. The failure process was real-time monitored through the response resistance change. Under the coupling condition, the lifetime was much shorter than that in single thermal cycle condition. Instead of the void accumulation mechanism, the excessive Joule heat was considered to be failure mechanism in coupling condition. The high temperature induced rapid dissolution of Cu UBM and overheat led to the melt of the solder.

Original languageEnglish (US)
Pages30-33
Number of pages4
DOIs
StatePublished - Jan 1 2013
Event2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013 - Dalian, China
Duration: Aug 11 2013Aug 14 2013

Other

Other2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013
CountryChina
CityDalian
Period8/11/138/14/13

Keywords

  • Chip Size Packaging
  • Electromigration
  • Mechanical-electrical Coupling
  • Solder joint
  • Thermal cycle

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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