Fabrication of large dual-polarized multichroic TES bolometer arrays for CMB measurements with the SPT-3G camera

C. M. Posada, P. A.R. Ade, Z. Ahmed, K. Arnold, J. E. Austermann, A. N. Bender, L. E. Bleem, B. A. Benson, K. Byrum, J. E. Carlstrom, C. L. Chang, H. M. Cho, S. T. Ciocys, J. F. Cliche, T. M. Crawford, A. Cukierman, D. Czaplewski, J. Ding, R. Divan, T. De HaanM. A. Dobbs, D. Dutcher, W. Everett, A. Gilbert, N. W. Halverson, N. L. Harrington, K. Hattori, J. W. Henning, G. C. Hilton, W. L. Holzapfel, J. Hubmayr, K. D. Irwin, O. Jeong, R. Keisler, D. Kubik, C. L. Kuo, A. T. Lee, E. M. Leitch, S. Lendinez, S. S. Meyer, C. S. Miller, J. Montgomery, M. Myers, A. Nadolski, T. Natoli, H. Nguyen, V. Novosad, S. Padin, Z. Pan, J. Pearson, J. E. Ruhl, B. R. Saliwanchik, G. Smecher, J. T. Sayre, E. Shirokoff, L. Stan, A. A. Stark, J. Sobrin, K. Story, A. Suzuki, K. L. Thompson, C. Tucker, K. Vanderlinde, J. D. Vieira, G. Wang, N. Whitehorn, V. Yefremenko, K. W. Yoon, K. E. Ziegler

Research output: Contribution to journalArticlepeer-review


This work presents the procedures used at Argonne National Laboratory to fabricate large arrays of multichroic transition-edge sensor (TES) bolometers for cosmic microwave background (CMB) measurements. These detectors will be assembled into the focal plane for the SPT-3G camera, the third generation CMB camera to be installed in the South Pole Telescope. The complete SPT-3G camera will have approximately 2690 pixels, for a total of 16 140 TES bolometric detectors. Each pixel is comprised of a broad-band sinuous antenna coupled to a Nb microstrip line. In-line filters are used to define the different bands before the millimeter-wavelength signal is fed to the respective Ti/Au TES bolometers. There are six TES bolometer detectors per pixel, which allow for measurements of three band-passes (95, 150 and 220 GHz) and two polarizations. The steps involved in the monolithic fabrication of these detector arrays are presented here in detail. Patterns are defined using a combination of stepper and contact lithography. The misalignment between layers is kept below 200 nm. The overall fabrication involves a total of 16 processes, including reactive and magnetron sputtering, reactive ion etching, inductively coupled plasma etching and chemical etching.

Original languageEnglish (US)
Article number094002
JournalSuperconductor Science and Technology
Issue number9
StatePublished - Sep 1 2015


  • CMB
  • TES detectors
  • bolometers
  • low loss microstrip
  • microfabrication
  • multichroic sensors
  • polarimetry

ASJC Scopus subject areas

  • Ceramics and Composites
  • Condensed Matter Physics
  • Metals and Alloys
  • Electrical and Electronic Engineering
  • Materials Chemistry


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