Fabrication of large dual-polarized multichroic TES bolometer arrays for CMB measurements with the SPT-3G camera

C. M. Posada; P. A.R. Ade; Z. Ahmed; K. Arnold; J. E. Austermann; A. N. Bender; L. E. Bleem; B. A. Benson; K. Byrum; J. E. Carlstrom; C. L. Chang; H. M. Cho; S. T. Ciocys; J. F. Cliche; T. M. Crawford; A. Cukierman; D. Czaplewski; J. Ding; R. Divan; T. De Haan; M. A. Dobbs; D. Dutcher; W. Everett; A. Gilbert; N. W. Halverson; N. L. Harrington; K. Hattori; J. W. Henning; G. C. Hilton; W. L. Holzapfel; J. Hubmayr; K. D. Irwin; O. Jeong; R. Keisler; D. Kubik; C. L. Kuo; A. T. Lee; E. M. Leitch; S. Lendinez; S. S. Meyer; C. S. Miller; J. Montgomery; M. Myers; A. Nadolski; T. Natoli; H. Nguyen; V. Novosad; S. Padin; Z. Pan; J. Pearson; J. E. Ruhl; B. R. Saliwanchik; G. Smecher; J. T. Sayre; E. Shirokoff; L. Stan; A. A. Stark; J. Sobrin; K. Story; A. Suzuki; K. L. Thompson; C. Tucker; K. Vanderlinde; J. D. Vieira; G. Wang; N. Whitehorn; V. Yefremenko; K. W. Yoon; K. E. Ziegler

doi:10.1088/0953-2048/28/9/094002

Fabrication of large dual-polarized multichroic TES bolometer arrays for CMB measurements with the SPT-3G camera

C. M. Posada, P. A.R. Ade, Z. Ahmed, K. Arnold, J. E. Austermann, A. N. Bender, L. E. Bleem, B. A. Benson, K. Byrum, J. E. Carlstrom, C. L. Chang, H. M. Cho, S. T. Ciocys, J. F. Cliche, T. M. Crawford, A. Cukierman, D. Czaplewski, J. Ding, R. Divan, T. De HaanM. A. Dobbs, D. Dutcher, W. Everett, A. Gilbert, N. W. Halverson, N. L. Harrington, K. Hattori, J. W. Henning, G. C. Hilton, W. L. Holzapfel, J. Hubmayr, K. D. Irwin, O. Jeong, R. Keisler, D. Kubik, C. L. Kuo, A. T. Lee, E. M. Leitch, S. Lendinez, S. S. Meyer, C. S. Miller, J. Montgomery, M. Myers, A. Nadolski, T. Natoli, H. Nguyen, V. Novosad, S. Padin, Z. Pan, J. Pearson, J. E. Ruhl, B. R. Saliwanchik, G. Smecher, J. T. Sayre, E. Shirokoff, L. Stan, A. A. Stark, J. Sobrin, K. Story, A. Suzuki, K. L. Thompson, C. Tucker, K. Vanderlinde, J. D. Vieira, G. Wang, N. Whitehorn, V. Yefremenko, K. W. Yoon, K. E. Ziegler

Research output: Contribution to journal › Article › peer-review

Abstract

This work presents the procedures used at Argonne National Laboratory to fabricate large arrays of multichroic transition-edge sensor (TES) bolometers for cosmic microwave background (CMB) measurements. These detectors will be assembled into the focal plane for the SPT-3G camera, the third generation CMB camera to be installed in the South Pole Telescope. The complete SPT-3G camera will have approximately 2690 pixels, for a total of 16 140 TES bolometric detectors. Each pixel is comprised of a broad-band sinuous antenna coupled to a Nb microstrip line. In-line filters are used to define the different bands before the millimeter-wavelength signal is fed to the respective Ti/Au TES bolometers. There are six TES bolometer detectors per pixel, which allow for measurements of three band-passes (95, 150 and 220 GHz) and two polarizations. The steps involved in the monolithic fabrication of these detector arrays are presented here in detail. Patterns are defined using a combination of stepper and contact lithography. The misalignment between layers is kept below 200 nm. The overall fabrication involves a total of 16 processes, including reactive and magnetron sputtering, reactive ion etching, inductively coupled plasma etching and chemical etching.

Original language	English (US)
Article number	094002
Journal	Superconductor Science and Technology
Volume	28
Issue number	9
DOIs	https://doi.org/10.1088/0953-2048/28/9/094002
State	Published - Sep 1 2015

Keywords

CMB
TES detectors
bolometers
low loss microstrip
microfabrication
multichroic sensors
polarimetry

ASJC Scopus subject areas

Ceramics and Composites
Condensed Matter Physics
Metals and Alloys
Electrical and Electronic Engineering
Materials Chemistry

Online availability

10.1088/0953-2048/28/9/094002

Library availability

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Posada, C. M., Ade, P. A. R., Ahmed, Z., Arnold, K., Austermann, J. E., Bender, A. N., Bleem, L. E., Benson, B. A., Byrum, K., Carlstrom, J. E., Chang, C. L., Cho, H. M., Ciocys, S. T., Cliche, J. F., Crawford, T. M., Cukierman, A., Czaplewski, D., Ding, J., Divan, R., ... Ziegler, K. E. (2015). Fabrication of large dual-polarized multichroic TES bolometer arrays for CMB measurements with the SPT-3G camera. Superconductor Science and Technology, 28(9), [094002]. https://doi.org/10.1088/0953-2048/28/9/094002

Posada, CM, Ade, PAR, Ahmed, Z, Arnold, K, Austermann, JE, Bender, AN, Bleem, LE, Benson, BA, Byrum, K, Carlstrom, JE, Chang, CL, Cho, HM, Ciocys, ST, Cliche, JF, Crawford, TM, Cukierman, A, Czaplewski, D, Ding, J, Divan, R, De Haan, T, Dobbs, MA, Dutcher, D, Everett, W, Gilbert, A, Halverson, NW, Harrington, NL, Hattori, K, Henning, JW, Hilton, GC, Holzapfel, WL, Hubmayr, J, Irwin, KD, Jeong, O, Keisler, R, Kubik, D, Kuo, CL, Lee, AT, Leitch, EM, Lendinez, S, Meyer, SS, Miller, CS, Montgomery, J, Myers, M, Nadolski, A, Natoli, T, Nguyen, H, Novosad, V, Padin, S, Pan, Z, Pearson, J, Ruhl, JE, Saliwanchik, BR, Smecher, G, Sayre, JT, Shirokoff, E, Stan, L, Stark, AA, Sobrin, J, Story, K, Suzuki, A, Thompson, KL, Tucker, C, Vanderlinde, K, Vieira, JD, Wang, G, Whitehorn, N, Yefremenko, V, Yoon, KW & Ziegler, KE 2015, 'Fabrication of large dual-polarized multichroic TES bolometer arrays for CMB measurements with the SPT-3G camera', Superconductor Science and Technology, vol. 28, no. 9, 094002. https://doi.org/10.1088/0953-2048/28/9/094002

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title = "Fabrication of large dual-polarized multichroic TES bolometer arrays for CMB measurements with the SPT-3G camera",

abstract = "This work presents the procedures used at Argonne National Laboratory to fabricate large arrays of multichroic transition-edge sensor (TES) bolometers for cosmic microwave background (CMB) measurements. These detectors will be assembled into the focal plane for the SPT-3G camera, the third generation CMB camera to be installed in the South Pole Telescope. The complete SPT-3G camera will have approximately 2690 pixels, for a total of 16 140 TES bolometric detectors. Each pixel is comprised of a broad-band sinuous antenna coupled to a Nb microstrip line. In-line filters are used to define the different bands before the millimeter-wavelength signal is fed to the respective Ti/Au TES bolometers. There are six TES bolometer detectors per pixel, which allow for measurements of three band-passes (95, 150 and 220 GHz) and two polarizations. The steps involved in the monolithic fabrication of these detector arrays are presented here in detail. Patterns are defined using a combination of stepper and contact lithography. The misalignment between layers is kept below 200 nm. The overall fabrication involves a total of 16 processes, including reactive and magnetron sputtering, reactive ion etching, inductively coupled plasma etching and chemical etching.",

keywords = "CMB, TES detectors, bolometers, low loss microstrip, microfabrication, multichroic sensors, polarimetry",

author = "Posada, {C. M.} and Ade, {P. A.R.} and Z. Ahmed and K. Arnold and Austermann, {J. E.} and Bender, {A. N.} and Bleem, {L. E.} and Benson, {B. A.} and K. Byrum and Carlstrom, {J. E.} and Chang, {C. L.} and Cho, {H. M.} and Ciocys, {S. T.} and Cliche, {J. F.} and Crawford, {T. M.} and A. Cukierman and D. Czaplewski and J. Ding and R. Divan and {De Haan}, T. and Dobbs, {M. A.} and D. Dutcher and W. Everett and A. Gilbert and Halverson, {N. W.} and Harrington, {N. L.} and K. Hattori and Henning, {J. W.} and Hilton, {G. C.} and Holzapfel, {W. L.} and J. Hubmayr and Irwin, {K. D.} and O. Jeong and R. Keisler and D. Kubik and Kuo, {C. L.} and Lee, {A. T.} and Leitch, {E. M.} and S. Lendinez and Meyer, {S. S.} and Miller, {C. S.} and J. Montgomery and M. Myers and A. Nadolski and T. Natoli and H. Nguyen and V. Novosad and S. Padin and Z. Pan and J. Pearson and Ruhl, {J. E.} and Saliwanchik, {B. R.} and G. Smecher and Sayre, {J. T.} and E. Shirokoff and L. Stan and Stark, {A. A.} and J. Sobrin and K. Story and A. Suzuki and Thompson, {K. L.} and C. Tucker and K. Vanderlinde and Vieira, {J. D.} and G. Wang and N. Whitehorn and V. Yefremenko and Yoon, {K. W.} and Ziegler, {K. E.}",

note = "Publisher Copyright: {\textcopyright} 2015 IOP Publishing Ltd.",

year = "2015",

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doi = "10.1088/0953-2048/28/9/094002",

language = "English (US)",

volume = "28",

journal = "Superconductor Science and Technology",

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T1 - Fabrication of large dual-polarized multichroic TES bolometer arrays for CMB measurements with the SPT-3G camera

AU - Posada, C. M.

AU - Ade, P. A.R.

AU - Ahmed, Z.

AU - Arnold, K.

AU - Austermann, J. E.

AU - Bender, A. N.

AU - Bleem, L. E.

AU - Benson, B. A.

AU - Byrum, K.

AU - Carlstrom, J. E.

AU - Chang, C. L.

AU - Cho, H. M.

AU - Ciocys, S. T.

AU - Cliche, J. F.

AU - Crawford, T. M.

AU - Cukierman, A.

AU - Czaplewski, D.

AU - Ding, J.

AU - Divan, R.

AU - De Haan, T.

AU - Dobbs, M. A.

AU - Dutcher, D.

AU - Everett, W.

AU - Gilbert, A.

AU - Halverson, N. W.

AU - Harrington, N. L.

AU - Hattori, K.

AU - Henning, J. W.

AU - Hilton, G. C.

AU - Holzapfel, W. L.

AU - Hubmayr, J.

AU - Irwin, K. D.

AU - Jeong, O.

AU - Keisler, R.

AU - Kubik, D.

AU - Kuo, C. L.

AU - Lee, A. T.

AU - Leitch, E. M.

AU - Lendinez, S.

AU - Meyer, S. S.

AU - Miller, C. S.

AU - Montgomery, J.

AU - Myers, M.

AU - Nadolski, A.

AU - Natoli, T.

AU - Nguyen, H.

AU - Novosad, V.

AU - Padin, S.

AU - Pan, Z.

AU - Pearson, J.

AU - Ruhl, J. E.

AU - Saliwanchik, B. R.

AU - Smecher, G.

AU - Sayre, J. T.

AU - Shirokoff, E.

AU - Stan, L.

AU - Stark, A. A.

AU - Sobrin, J.

AU - Story, K.

AU - Suzuki, A.

AU - Thompson, K. L.

AU - Tucker, C.

AU - Vanderlinde, K.

AU - Vieira, J. D.

AU - Wang, G.

AU - Whitehorn, N.

AU - Yefremenko, V.

AU - Yoon, K. W.

AU - Ziegler, K. E.

PY - 2015/9/1

Y1 - 2015/9/1

N2 - This work presents the procedures used at Argonne National Laboratory to fabricate large arrays of multichroic transition-edge sensor (TES) bolometers for cosmic microwave background (CMB) measurements. These detectors will be assembled into the focal plane for the SPT-3G camera, the third generation CMB camera to be installed in the South Pole Telescope. The complete SPT-3G camera will have approximately 2690 pixels, for a total of 16 140 TES bolometric detectors. Each pixel is comprised of a broad-band sinuous antenna coupled to a Nb microstrip line. In-line filters are used to define the different bands before the millimeter-wavelength signal is fed to the respective Ti/Au TES bolometers. There are six TES bolometer detectors per pixel, which allow for measurements of three band-passes (95, 150 and 220 GHz) and two polarizations. The steps involved in the monolithic fabrication of these detector arrays are presented here in detail. Patterns are defined using a combination of stepper and contact lithography. The misalignment between layers is kept below 200 nm. The overall fabrication involves a total of 16 processes, including reactive and magnetron sputtering, reactive ion etching, inductively coupled plasma etching and chemical etching.

AB - This work presents the procedures used at Argonne National Laboratory to fabricate large arrays of multichroic transition-edge sensor (TES) bolometers for cosmic microwave background (CMB) measurements. These detectors will be assembled into the focal plane for the SPT-3G camera, the third generation CMB camera to be installed in the South Pole Telescope. The complete SPT-3G camera will have approximately 2690 pixels, for a total of 16 140 TES bolometric detectors. Each pixel is comprised of a broad-band sinuous antenna coupled to a Nb microstrip line. In-line filters are used to define the different bands before the millimeter-wavelength signal is fed to the respective Ti/Au TES bolometers. There are six TES bolometer detectors per pixel, which allow for measurements of three band-passes (95, 150 and 220 GHz) and two polarizations. The steps involved in the monolithic fabrication of these detector arrays are presented here in detail. Patterns are defined using a combination of stepper and contact lithography. The misalignment between layers is kept below 200 nm. The overall fabrication involves a total of 16 processes, including reactive and magnetron sputtering, reactive ion etching, inductively coupled plasma etching and chemical etching.

KW - CMB

KW - TES detectors

KW - bolometers

KW - low loss microstrip

KW - microfabrication

KW - multichroic sensors

KW - polarimetry

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U2 - 10.1088/0953-2048/28/9/094002

DO - 10.1088/0953-2048/28/9/094002

M3 - Article

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SN - 0953-2048

VL - 28

JO - Superconductor Science and Technology

JF - Superconductor Science and Technology

IS - 9

M1 - 094002

ER -

Fabrication of large dual-polarized multichroic TES bolometer arrays for CMB measurements with the SPT-3G camera

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