TY - GEN
T1 - Fabrication and characterization of biologically inspired mushroom-shaped elastomer microfiber arrays
AU - Kim, Seok
AU - Sitti, Metin
PY - 2009
Y1 - 2009
N2 - This paper reports enhanced adhesion and friction of biologically inspired mushroom-shaped elastomer microfibers which are fabricated using micromolding and the notching effect during deep reactive ion etching (DRIE). The fabrication approach of this work allows mushroom-shaped small diameter fibers down to 100s of nanometer scale (using interference lithography) with high uniformity, and high yield in large area. The fabricated mierofiber arrays demonstrate approximately up to 17 time higher adhesion and around twice higher static friction than the nonfibrillar flat elastomer surface on a 6 mm diameter glass hemisphere. Moreover, adhesion experiments with the mierofiber arrays which have different thickness backing layers reveal the significance of the backing layer thickness on adhesion of the fiber arrays on smooth contact surfaces.
AB - This paper reports enhanced adhesion and friction of biologically inspired mushroom-shaped elastomer microfibers which are fabricated using micromolding and the notching effect during deep reactive ion etching (DRIE). The fabrication approach of this work allows mushroom-shaped small diameter fibers down to 100s of nanometer scale (using interference lithography) with high uniformity, and high yield in large area. The fabricated mierofiber arrays demonstrate approximately up to 17 time higher adhesion and around twice higher static friction than the nonfibrillar flat elastomer surface on a 6 mm diameter glass hemisphere. Moreover, adhesion experiments with the mierofiber arrays which have different thickness backing layers reveal the significance of the backing layer thickness on adhesion of the fiber arrays on smooth contact surfaces.
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M3 - Conference contribution
AN - SCOPUS:69949132475
SN - 9780791843253
SN - 9780791843284
T3 - 2008 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008
SP - 839
EP - 847
BT - 2008 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008
T2 - 2008 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008
Y2 - 3 August 2008 through 6 August 2008
ER -