Abstract
Failures of solder joints often result from development of cracks under complex mixed-mode loading conditions. In this study, a flexural peel technique was developed to investigate the growth of cracks at the interface between solder and Cu. The technique was based on a tri-layer solder/Cu joints, with the solder layer sandwiched between two Cu layers of desired thicknesses. Finite element analysis was used to calculate the Mode-I and Mode-II strain energy release rates as a function of the thicknesses of Cu outerlayers and the solder interlayer. The application of this technique to studying interface crack growth under fatigue loading is demonstrated for eutectic solder joints.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 7 |
| Number of pages | 1 |
| Journal | American Society of Mechanical Engineers (Paper) |
| State | Published - 1995 |
| Event | Proceedings of the 1995 ASME International Mechanical Engineering Congress & Exposition - San Francisco, CA, USA Duration: Nov 12 1995 → Nov 17 1995 |
ASJC Scopus subject areas
- Mechanical Engineering