Experimental technique for studying mixed-mode crack growth in solder joints

Daping Yao, Zhehua Zhang, Jian Ku Shang

Research output: Contribution to journalConference articlepeer-review


Failures of solder joints often result from development of cracks under complex mixed-mode loading conditions. In this study, a flexural peel technique was developed to investigate the growth of cracks at the interface between solder and Cu. The technique was based on a tri-layer solder/Cu joints, with the solder layer sandwiched between two Cu layers of desired thicknesses. Finite element analysis was used to calculate the Mode-I and Mode-II strain energy release rates as a function of the thicknesses of Cu outerlayers and the solder interlayer. The application of this technique to studying interface crack growth under fatigue loading is demonstrated for eutectic solder joints.

Original languageEnglish (US)
Pages (from-to)7
Number of pages7
JournalAmerican Society of Mechanical Engineers (Paper)
StatePublished - 1995
EventProceedings of the 1995 ASME International Mechanical Engineering Congress & Exposition - San Francisco, CA, USA
Duration: Nov 12 1995Nov 17 1995

ASJC Scopus subject areas

  • Mechanical Engineering


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