@inproceedings{fbf4413df2384b11961b6fb22a774abb,
title = "Experimental study of supply voltage stability during ESD",
abstract = "On-chip power supply integrity may be compromised during a power-on ESD event, e.g. system-level ESD. Experimental data are provided to show that the supply integrity is a function of the rail clamp gain, its speed of response to ESD, and the amount of on-chip supply decoupling capacitance. It is also demonstrated that just a few nH of package inductance can cause the on-chip supply to briefly collapse, regardless of the rail clamp response speed.",
keywords = "ESD, power integrity, rail clamp",
author = "Yang Xiu and Robert Mertens and Nicholas Thomson and Elyse Rosenbaum",
note = "This work is supported by Semiconductor Research Corporation (SRC) task #1836.141 through The University of Texas at Dallas' Texas Analog Center of Excellence (TxACE). The authors would like to thank High Powered Pulse Instruments for use of their TLP system; 2016 International Reliability Physics Symposium, IRPS 2016 ; Conference date: 17-04-2016 Through 21-04-2016",
year = "2016",
month = sep,
day = "22",
doi = "10.1109/IRPS.2016.7574560",
language = "English (US)",
series = "IEEE International Reliability Physics Symposium Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "6A61--6A66",
booktitle = "2016 International Reliability Physics Symposium, IRPS 2016",
address = "United States",
}