@inproceedings{fbf4413df2384b11961b6fb22a774abb,
title = "Experimental study of supply voltage stability during ESD",
abstract = "On-chip power supply integrity may be compromised during a power-on ESD event, e.g. system-level ESD. Experimental data are provided to show that the supply integrity is a function of the rail clamp gain, its speed of response to ESD, and the amount of on-chip supply decoupling capacitance. It is also demonstrated that just a few nH of package inductance can cause the on-chip supply to briefly collapse, regardless of the rail clamp response speed.",
keywords = "ESD, power integrity, rail clamp",
author = "Yang Xiu and Robert Mertens and Nicholas Thomson and Elyse Rosenbaum",
note = "Funding Information: This work is supported by Semiconductor Research Corporation (SRC) task #1836.141 through The University of Texas at Dallas' Texas Analog Center of Excellence (TxACE). The authors would like to thank High Powered Pulse Instruments for use of their TLP system Publisher Copyright: {\textcopyright} 2016 IEEE.; 2016 International Reliability Physics Symposium, IRPS 2016 ; Conference date: 17-04-2016 Through 21-04-2016",
year = "2016",
month = sep,
day = "22",
doi = "10.1109/IRPS.2016.7574560",
language = "English (US)",
series = "IEEE International Reliability Physics Symposium Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "6A61--6A66",
booktitle = "2016 International Reliability Physics Symposium, IRPS 2016",
address = "United States",
}