Experimental study of supply voltage stability during ESD

Yang Xiu, Robert Mertens, Nicholas Thomson, Elyse Rosenbaum

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

On-chip power supply integrity may be compromised during a power-on ESD event, e.g. system-level ESD. Experimental data are provided to show that the supply integrity is a function of the rail clamp gain, its speed of response to ESD, and the amount of on-chip supply decoupling capacitance. It is also demonstrated that just a few nH of package inductance can cause the on-chip supply to briefly collapse, regardless of the rail clamp response speed.

Original languageEnglish (US)
Title of host publication2016 International Reliability Physics Symposium, IRPS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages6A61-6A66
ISBN (Electronic)9781467391368
DOIs
StatePublished - Sep 22 2016
Event2016 International Reliability Physics Symposium, IRPS 2016 - Pasadena, United States
Duration: Apr 17 2016Apr 21 2016

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
Volume2016-September
ISSN (Print)1541-7026

Other

Other2016 International Reliability Physics Symposium, IRPS 2016
CountryUnited States
CityPasadena
Period4/17/164/21/16

Keywords

  • ESD
  • power integrity
  • rail clamp

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Xiu, Y., Mertens, R., Thomson, N., & Rosenbaum, E. (2016). Experimental study of supply voltage stability during ESD. In 2016 International Reliability Physics Symposium, IRPS 2016 (pp. 6A61-6A66). [7574560] (IEEE International Reliability Physics Symposium Proceedings; Vol. 2016-September). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IRPS.2016.7574560