Experimental characterization of transmission lines in thin-film multichip modules

Steven Lipa; Michael B. Steer; Andreas C. Cangellaris; Paul D. Franzon

doi:10.1109/95.486623

Experimental characterization of transmission lines in thin-film multichip modules

Steven Lipa, Michael B. Steer, Andreas C. Cangellaris, Paul D. Franzon

Research output: Contribution to journal › Article › peer-review

Abstract

Signal propagation on transmission lines fabricated in thin polyimide films on silicon substrates is investigated. Series resistive and shunt conductive losses are separated and it is shown that the effective dielectric loss is much higher than that expected from bulk material properties.

Original language	English (US)
Pages (from-to)	122-125
Number of pages	4
Journal	IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Volume	19
Issue number	1
DOIs	https://doi.org/10.1109/95.486623
State	Published - Mar 1 1996
Externally published	Yes

Keywords

Lossy transmission lines
Polyimide dielectric
Thin-film MCM

ASJC Scopus subject areas

Engineering(all)

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10.1109/95.486623

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title = "Experimental characterization of transmission lines in thin-film multichip modules",

abstract = "Signal propagation on transmission lines fabricated in thin polyimide films on silicon substrates is investigated. Series resistive and shunt conductive losses are separated and it is shown that the effective dielectric loss is much higher than that expected from bulk material properties.",

keywords = "Lossy transmission lines, Polyimide dielectric, Thin-film MCM",

author = "Steven Lipa and Steer, {Michael B.} and Cangellaris, {Andreas C.} and Franzon, {Paul D.}",

year = "1996",

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AU - Cangellaris, Andreas C.

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KW - Thin-film MCM

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