@article{2c6dc35d41714117b7e699c08454e9ee,
title = "Experimental characterization of transmission lines in thin-film multichip modules",
abstract = "Signal propagation on transmission lines fabricated in thin polyimide films on silicon substrates is investigated. Series resistive and shunt conductive losses are separated and it is shown that the effective dielectric loss is much higher than that expected from bulk material properties.",
keywords = "Lossy transmission lines, Polyimide dielectric, Thin-film MCM",
author = "Steven Lipa and Steer, {Michael B.} and Cangellaris, {Andreas C.} and Franzon, {Paul D.}",
note = "Manuscnpt received October 22, 1993; revised October, 1995. This paper was presented in part at the IEEE 2nd Topical Meetmg on Electncal Performance of Electronic Packaging, Monterey, CA, October 20-22, 1993 This work was supported in part by the National Science Foundation through Grant MIPS-9017054 S Lipa, M B Steer, and P D Franzon are with the Picosecond Digital Systems Laboratoiy, Department of Electncal and Computer Engineenng, North Carolina State university, Raleigh, NC 27695-791 1 USA A C Cangellans is with the Department of Electncal and Computer Engineenng, University of Anzona, Tucson, AZ 85721 USA Publisher Item Identifier S 1070-9886(96)00896-7",
year = "1996",
month = mar,
doi = "10.1109/95.486623",
language = "English (US)",
volume = "19",
pages = "122--125",
journal = "IEEE Transactions on Components Packaging and Manufacturing Technology Part A",
issn = "1070-9886",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "1",
}