Experimental characterization of transmission lines in thin-film multichip modules

Steven Lipa, Michael B. Steer, Andreas C. Cangellaris, Paul D. Franzon

Research output: Contribution to journalArticlepeer-review

Abstract

Signal propagation on transmission lines fabricated in thin polyimide films on silicon substrates is investigated. Series resistive and shunt conductive losses are separated and it is shown that the effective dielectric loss is much higher than that expected from bulk material properties.

Original languageEnglish (US)
Pages (from-to)122-125
Number of pages4
JournalIEEE Transactions on Components Packaging and Manufacturing Technology Part A
Volume19
Issue number1
DOIs
StatePublished - Mar 1 1996
Externally publishedYes

Keywords

  • Lossy transmission lines
  • Polyimide dielectric
  • Thin-film MCM

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Experimental characterization of transmission lines in thin-film multichip modules'. Together they form a unique fingerprint.

Cite this