TY - GEN
T1 - Expedient Prediction of Eye Opening of High-Speed Links with Input Design Space Dimensionality Reduction
AU - Ma, Hanzhi
AU - Li, Er Ping
AU - Cangellaris, Andreas C.
AU - Chen, Xu
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/7
Y1 - 2020/7
N2 - We propose a new method, named Support Vector Regression-based Active Subspace, for the reduction of the dimensionality of the high-dimensional input space of design parameters pertinent to the predictive assessment of the eye opening prediction of high-speed links with IBIS-AMI transmitter and receiver equalization. We compare the method with Support Vector Regression model and Principal Component Analysis-based dimensionality reduction algorithm. Numerical results show that proposed method exhibits the best accuracy in predicting eye height, eye width, and eye width at 10-12 BER in the presence of correlated design variability.
AB - We propose a new method, named Support Vector Regression-based Active Subspace, for the reduction of the dimensionality of the high-dimensional input space of design parameters pertinent to the predictive assessment of the eye opening prediction of high-speed links with IBIS-AMI transmitter and receiver equalization. We compare the method with Support Vector Regression model and Principal Component Analysis-based dimensionality reduction algorithm. Numerical results show that proposed method exhibits the best accuracy in predicting eye height, eye width, and eye width at 10-12 BER in the presence of correlated design variability.
KW - Support vector regression
KW - active subspace
KW - dimensionality reduction
KW - high-speed link analysis
KW - principle component analysis
UR - http://www.scopus.com/inward/record.url?scp=85091835578&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85091835578&partnerID=8YFLogxK
U2 - 10.1109/EMCSI38923.2020.9191544
DO - 10.1109/EMCSI38923.2020.9191544
M3 - Conference contribution
AN - SCOPUS:85091835578
T3 - 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020
SP - 236
EP - 240
BT - 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020
Y2 - 28 July 2020 through 28 August 2020
ER -