Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating

Cai Chen; Lei Zhang; Qingquan Lai; Caifu Li; J. K. Shang

doi:10.1007/s10854-011-0292-2

Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating

Cai Chen, Lei Zhang, Qingquan Lai, Caifu Li, J. K. Shang

Research output: Contribution to journal › Article › peer-review

Abstract

Solder wettability of Sn/FeNi plated on copper coupon after various aging conditions was tested by the wetting balance method to investigate the influence of interfacial intermetallic compound (I-IMC) growth on the solderability of tinned FeNi plating. The wetting force was found to decrease slightly with the growth of a primary FeSn ₂ layer at the Sn/FeNi interface. Subsequent growth of a CuNiSn compound layer over FeSn ₂ improved wettability, resulting in an increase of the wetting force by 0.035 ± 0.005 N/m. The results indicated that the evolution of the solder wettability was related to different I-IMCs sequentially formed at the Sn/FeNi interface.

Original language	English (US)
Pages (from-to)	1234-1238
Number of pages	5
Journal	Journal of Materials Science: Materials in Electronics
Volume	22
Issue number	9
DOIs	https://doi.org/10.1007/s10854-011-0292-2
State	Published - Sep 2011
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Electrical and Electronic Engineering

Online availability

10.1007/s10854-011-0292-2

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title = "Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating",

abstract = "Solder wettability of Sn/FeNi plated on copper coupon after various aging conditions was tested by the wetting balance method to investigate the influence of interfacial intermetallic compound (I-IMC) growth on the solderability of tinned FeNi plating. The wetting force was found to decrease slightly with the growth of a primary FeSn 2 layer at the Sn/FeNi interface. Subsequent growth of a CuNiSn compound layer over FeSn 2 improved wettability, resulting in an increase of the wetting force by 0.035 ± 0.005 N/m. The results indicated that the evolution of the solder wettability was related to different I-IMCs sequentially formed at the Sn/FeNi interface.",

author = "Cai Chen and Lei Zhang and Qingquan Lai and Caifu Li and Shang, {J. K.}",

note = "Funding Information: Acknowledgments This work was supported by the National Natural Science Foundation of China (Grant No. 50501022) and the National Basic Research Program of China (Grant No. 2010CB631006).",

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doi = "10.1007/s10854-011-0292-2",

language = "English (US)",

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TY - JOUR

T1 - Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating

AU - Chen, Cai

AU - Zhang, Lei

AU - Lai, Qingquan

AU - Li, Caifu

AU - Shang, J. K.

N1 - Funding Information: Acknowledgments This work was supported by the National Natural Science Foundation of China (Grant No. 50501022) and the National Basic Research Program of China (Grant No. 2010CB631006).

PY - 2011/9

Y1 - 2011/9

N2 - Solder wettability of Sn/FeNi plated on copper coupon after various aging conditions was tested by the wetting balance method to investigate the influence of interfacial intermetallic compound (I-IMC) growth on the solderability of tinned FeNi plating. The wetting force was found to decrease slightly with the growth of a primary FeSn 2 layer at the Sn/FeNi interface. Subsequent growth of a CuNiSn compound layer over FeSn 2 improved wettability, resulting in an increase of the wetting force by 0.035 ± 0.005 N/m. The results indicated that the evolution of the solder wettability was related to different I-IMCs sequentially formed at the Sn/FeNi interface.

AB - Solder wettability of Sn/FeNi plated on copper coupon after various aging conditions was tested by the wetting balance method to investigate the influence of interfacial intermetallic compound (I-IMC) growth on the solderability of tinned FeNi plating. The wetting force was found to decrease slightly with the growth of a primary FeSn 2 layer at the Sn/FeNi interface. Subsequent growth of a CuNiSn compound layer over FeSn 2 improved wettability, resulting in an increase of the wetting force by 0.035 ± 0.005 N/m. The results indicated that the evolution of the solder wettability was related to different I-IMCs sequentially formed at the Sn/FeNi interface.

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Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating

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