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Evaluation of the deformation fields and bond integrity of Cu/SS joints
J. F. Stubbins
, J. Collins, J. Min
Nuclear, Plasma, and Radiological Engineering
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Dive into the research topics of 'Evaluation of the deformation fields and bond integrity of Cu/SS joints'. Together they form a unique fingerprint.
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Keyphrases
Deformation Field
100%
Pre-crack
100%
Cu-SS
100%
Bond Integrity
100%
Finite Element Modeling
50%
Stress State
50%
Bending Bars
50%
Finite Element Model
25%
High Stress Concentration
25%
Close Proximity
25%
Modeling Techniques
25%
Bulk Material
25%
Interface Layer
25%
Maximum Stress
25%
SS316L
25%
Stress Concentration
25%
Hot Isostatic Pressing
25%
Major Axis
25%
Behavior Observation
25%
Modeling Effort
25%
Complicating Factors
25%
Specimen Configuration
25%
Preparatory Work
25%
Glidcop
25%
Non-conventional Specimens
25%
Engineering
Joints (Structural Components)
100%
Deformation Field
100%
Finite Element Modeling
75%
Stress Concentration
50%
Stress State
50%
Experimental Observation
25%
Close Proximity
25%
Bulk Material
25%
Interface Layer
25%
Maximum Stress
25%
Hot Isostatic Pressing
25%
Specimen Configuration
25%
Major Axis
25%
Inclined Joint
25%
Material Science
Finite Element Modeling
100%
Stress Concentration
66%
Hot Isostatic Pressing
33%