Evaluation of defects in seal region of food packages using the Backscattered Amplitude Integral (BAI) technique

Ayhan Ozguler, Scott A Morris, William D. O'Brien

Research output: Contribution to journalArticlepeer-review

Abstract

The focus of this study is to evaluate the image contrast, denoted ΔBAI, for various packaging materials, and defect types and their sizes. This study applied the pulse-echo Backscattered Amplitude Integral (BAI) method to visualize and evaluate defects in the seal area of flexible food packages which might cause both economic loss and health hazards. This method yields an image, the BAI-mode image. It has been shown that there is a direct relation between the defect size and ΔBAI value, and that different defect types and packaging materials have a significant impact on the ΔBAI value.

Original languageEnglish (US)
Pages (from-to)689-692
Number of pages4
JournalProceedings of the IEEE Ultrasonics Symposium
Volume1
StatePublished - 1997

ASJC Scopus subject areas

  • Engineering(all)

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