TY - GEN
T1 - ETS-A
T2 - 1996 European Conference on Design and Test, EDTC 1996
AU - Cheng, Yi Kan
AU - Rosenbaum, Elyse
AU - Kang, Sung Mo
N1 - Funding Information:
*This research was supported in part by Intel Corporation, JSEP (N00014-94-J-1270), and Semiconductor Research Corp. (SRC94-DP-109).
Publisher Copyright:
© 1996 IEEE.
PY - 1996/3/11
Y1 - 1996/3/11
N2 - In view of the increasing density on integrated circuit devices for higher operation speed and larger scale of integration, the power density and the resulting temperature on the chip surface increase accordingly. In order to predict the temperature profile as well as the corresponding electrical performance of VLSI circuits, a new electrothermal simulator was developed. By automating the layout extraction, accurate fast timing-based power calculation, the analytical temperature estimation, and the uncoupled electrothermal simulation, the on-chip thermal reliability and timing problems can be accurately and quickly predicted.
AB - In view of the increasing density on integrated circuit devices for higher operation speed and larger scale of integration, the power density and the resulting temperature on the chip surface increase accordingly. In order to predict the temperature profile as well as the corresponding electrical performance of VLSI circuits, a new electrothermal simulator was developed. By automating the layout extraction, accurate fast timing-based power calculation, the analytical temperature estimation, and the uncoupled electrothermal simulation, the on-chip thermal reliability and timing problems can be accurately and quickly predicted.
UR - http://www.scopus.com/inward/record.url?scp=85030111148&partnerID=8YFLogxK
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U2 - 10.1109/EDTC.1996.494357
DO - 10.1109/EDTC.1996.494357
M3 - Conference contribution
AN - SCOPUS:85030111148
T3 - Proceedings of the 1996 European Conference on Design and Test, EDTC 1996
SP - 566
EP - 570
BT - Proceedings of the 1996 European Conference on Design and Test, EDTC 1996
PB - Association for Computing Machinery, Inc
Y2 - 11 March 1996 through 14 March 1996
ER -