@inproceedings{a08ec8b24e3543ecadc282664517a6fa,
title = "ETS-A: A new electrothermal simulator for CMOS VLSI circuits",
abstract = "In view of the increasing density on integrated circuit devices for higher operation speed and larger scale of integration, the power density and the resulting temperature on the chip surface increase accordingly. In order to predict the temperature profile as well as the corresponding electrical performance of VLSI circuits, a new electrothermal simulator was developed. By automating the layout extraction, accurate fast timing-based power calculation, the analytical temperature estimation, and the uncoupled electrothermal simulation, the on-chip thermal reliability and timing problems can be accurately and quickly predicted.",
author = "Cheng, {Yi Kan} and Elyse Rosenbaum and Kang, {Sung Mo}",
note = "Publisher Copyright: {\textcopyright} 1996 IEEE.; 1996 European Conference on Design and Test, EDTC 1996 ; Conference date: 11-03-1996 Through 14-03-1996",
year = "1996",
month = mar,
day = "11",
doi = "10.1109/EDTC.1996.494357",
language = "English (US)",
series = "Proceedings of the 1996 European Conference on Design and Test, EDTC 1996",
publisher = "Association for Computing Machinery",
pages = "566--570",
booktitle = "Proceedings of the 1996 European Conference on Design and Test, EDTC 1996",
address = "United States",
}