Estimation of adhesive bond strength in laminated safety glass using guided mechanical waves

Shihong Huo, Henrique Reis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Laminated safety glass samples with different levels of adhesive bond strength were manufactured and tested using mechanical guided waves. The adhesive bond strength of the test samples was then also evaluated using the commonly used destructive testing method, i.e., the pummel test method. The imperfect interfaces between the plastic interface and the two adjacent glass plates were modeled using a bed of longitudinal and shear springs. The spring constants were estimated using fracture mechanics concepts in conjunction with surface analysis of the plastic interlayer and of the two adjacent glass plates using atomic force microscopy and profilometer measurements. In addition to mode shape analysis, the phase and energy velocities were calculated and discussed. The guided wave theoretical predictions of adhesion levels (obtained using this multilayered model) were validated using the pummel test results. Results show that this approach is useful in the nondestructive assessment of adhesive bond strength in laminated safety glass.

Original languageEnglish (US)
Title of host publicationSensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2007
DOIs
StatePublished - 2007
EventSensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2007 - San Diego, CA, United States
Duration: Mar 19 2007Mar 22 2007

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6529 PART 1
ISSN (Print)0277-786X

Other

OtherSensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2007
Country/TerritoryUnited States
CitySan Diego, CA
Period3/19/073/22/07

Keywords

  • Attenuation
  • Energy velocity
  • Guided waves
  • Laminated safety glass
  • Mode shape
  • Phase velocity
  • Ultrasonics

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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