Epitaxial bonding and transfer processes for large-scale heterogeneously integrated electronic-photonic circuitry

John A. Carlson, Coleman G. Williams, Maanav Ganjoo, John M. Dallesasse

Research output: Contribution to journalArticlepeer-review

Abstract

A process flow for the heterogeneous integration of III-V epitaxial material onto a silicon host wafer using CMOS-compatible materials and methods toward the goal of forming electronic-photonic circuitry is presented. Epitaxial structures for compoundsemiconductor- based transistors are assembled on a silicon carrier wafer using a commercially-available polymer and then formed into distinct patterns for scalable processing. A CMOS-compatible metallization process is performed on the back side collector terminal of the aligned epitaxial structures, followed by a metal-eutectic bonding process that transfers the wafer-scale array of III-V material onto a separate silicon host wafer allowing the fabrication of both electronic and photonic devices on a single wafer. Characterization of the epitaxial bonding and transfer is performed to ensure material alignment is maintained without additional tooling and that the interconnect layer established between III-V collector and silicon host wafer performs as an ohmic contact, thermal path, and mechanical bond compatible with back-end-of-line (BEOL) integrated circuit processing. These processes are shown for GaAs-based light-emitting transistor (LET) epitaxial material to demonstrate that subsequent photonic devices and systems may be patterned into the integrated material allowing a direct electrical interconnect to embedded CMOS-based electronic systems for new functionalities as electronic-photonic integrated circuitry.

Original languageEnglish (US)
Pages (from-to)D3158-D3166
JournalJournal of the Electrochemical Society
Volume166
Issue number1
DOIs
StatePublished - 2019

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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