TY - GEN
T1 - Enhanced spacer-is-dielectric (SID) decomposition flow with model-based verification
AU - Du, Yuelin
AU - Song, Hua
AU - Shiely, James
AU - Wong, Martin D.F.
PY - 2013
Y1 - 2013
N2 - Self-aligned double patterning (SADP) lithography is a leading candidate for 14nm node lower-metal layer fabrication. Besides the intrinsic overlay-tolerance capability, the accurate spacer width and uniformity control enables such technology to fabricate very narrow and dense patterns. Spacer-is-dielectric (SID) is the most popular flavor of SADP with higher flexibility in design. In the SID process, due to uniform spacer deposition, the spacer shape gets rounded at convex mandrel corners, and disregarding the corner rounding issue during SID decomposition may result in severe residue artifacts on device patterns. Previously, SADP decomposition was merely verified by Boolean operations on the decomposed layers, where the residue artifacts are not even identifiable. This paper proposes a model-based verification method for SID decomposition to identify the artifacts caused by spacer corner rounding. Then targeting residue artifact removal, an enhanced SID decomposition flow is introduced. Simulation results show that residue artifacts are removed effectively through the enhanced SID decomposition strategy.
AB - Self-aligned double patterning (SADP) lithography is a leading candidate for 14nm node lower-metal layer fabrication. Besides the intrinsic overlay-tolerance capability, the accurate spacer width and uniformity control enables such technology to fabricate very narrow and dense patterns. Spacer-is-dielectric (SID) is the most popular flavor of SADP with higher flexibility in design. In the SID process, due to uniform spacer deposition, the spacer shape gets rounded at convex mandrel corners, and disregarding the corner rounding issue during SID decomposition may result in severe residue artifacts on device patterns. Previously, SADP decomposition was merely verified by Boolean operations on the decomposed layers, where the residue artifacts are not even identifiable. This paper proposes a model-based verification method for SID decomposition to identify the artifacts caused by spacer corner rounding. Then targeting residue artifact removal, an enhanced SID decomposition flow is introduced. Simulation results show that residue artifacts are removed effectively through the enhanced SID decomposition strategy.
KW - Model-Based verification
KW - Residue artifact removal
KW - SID decomposition
UR - http://www.scopus.com/inward/record.url?scp=84878549790&partnerID=8YFLogxK
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U2 - 10.1117/12.2011029
DO - 10.1117/12.2011029
M3 - Conference contribution
AN - SCOPUS:84878549790
SN - 9780819494665
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Design for Manufacturability through Design-Process Integration VII
T2 - SPIE Conference on Designfor Manufacturability through Design-Process Integration, DfM-DPI 2013
Y2 - 27 February 2013 through 28 February 2013
ER -