A convenient skin effect model for the Partial Element Equivalent Circuits (PEEC) technique is the so called volume filament technique. This approach is an integral part of the basic PEEC model if the conductor cross-sections are subdivided into cells. This model is efficient for geometries and frequencies where the skin depth is moderate compared to the conductor thickness. However, the computational cost may be too high for the case where the skin depth is a small fraction of the cross-section, especially if it is subdivided into uniform cells. In this paper, a model is presented that is suitable for all frequency regimes of interest, and thus is most appropriate for transient interconnect analysis using a full-wave model denoted as (Lp, P, Zs, τ) PEEC, to indicate the inclusion of the complex skin effect model Zs.
|Original language||English (US)|
|Number of pages||4|
|Journal||IEEE Topical Meeting on Electrical Performance of Electronic Packaging|
|State||Published - 1999|
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