Keyphrases
Nano-aluminum
100%
Copper Surface
100%
Micro-nano Structure
100%
Nanoporous Copper
100%
Refrigerant
100%
Aluminum Surface
100%
R1233zd(E)
100%
Internal Condensation
100%
Dimensionless Parameters
50%
Pressure Drop
50%
Heat Transfer Coefficient
50%
Microstructure
25%
Extrusion
25%
Chemical Oxidation
25%
Copper(II) Oxide
25%
Film Thickness
25%
Nanostructured Surfaces
25%
Mini
25%
Heat Transfer
25%
Surface Enhancement
25%
Bond number
25%
In-tube
25%
Electronics Thermal Management
25%
Heat Transfer Enhancement
25%
Refrigeration
25%
Hydrochloric Acid
25%
Acid Etching
25%
Mass Flux
25%
Costing Methods
25%
Oxide Structure
25%
Aluminum Oxidation
25%
Friction Factor
25%
Air Conditioning
25%
Weber number
25%
Heat Pressure
25%
Thermal Efficiency
25%
Microstructured Surface
25%
Manufacturing Cost
25%
Scalable Nanomanufacturing
25%
Hydrofluorocarbons
25%
Heat Exchanger Design
25%
Condensation Heat Transfer
25%
Thermal-hydraulic Performance
25%
Micro-surfacing
25%
Wetted Area
25%
Heat Exchanger Sizing
25%
Condensate Film
25%
Saturated Liquid
25%
In-tube Condensation
25%
Saturated Vapor
25%
Current Enhancement
25%
Enhancement Approaches
25%
Complete Phase Change
25%
Engineering
Dimensionless Parameter
100%
Internals
100%
Heat Transfer Coefficient
100%
Pressure Drop
100%
Air Conditioning
50%
Mass Transfer
50%
Microstructure
50%
Bond Number
50%
Exchanger
50%
Tubes (Components)
50%
Nanomanufacturing System
50%
Nanostructured Surface
50%
Thermal Efficiency
50%
Thermal Hydraulics
50%
Friction Factor
50%
Heat Transfer Enhancement
50%
Manufacturing Cost
50%
Hydrochloric Acid
50%
Condensation Heat Transfer Coefficient
50%
Chemical Oxidation
50%
Condensate Film
50%
Internal Diameter
50%
Saturated Liquid
50%
Saturated Vapor
50%
Electronics Thermal Management
50%
Chemical Engineering
Heat Transfer Coefficient
100%
Copper Oxide
33%
Mass Transfer
33%
Nanomanufacturing System
33%
Hydrochloric Acid
33%
Thermal Management (Electronics)
33%