Enhanced boiling heat transfer with copper oxide hierarchical surfaces

K. H. Chu, Y. Zhu, N. Miljkovic, Y. Nam, R. Enright, E. N. Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We experimentally investigated the enhancement in critical heat flux (CHF) during pool boiling on copper oxide (CuO) hierarchical surfaces, where surface roughness at multiple length scales is presented. On the surface with the highest surface roughness factor of 13.3, a CHF of 250 W/cm2 and heat transfer coefficient of 8×104 W/m2 K, were achieved. A good agreement between our developed model and experimental results supports the idea that roughness-amplified surface forces are responsible for CHF enhancement on structured surfaces. The work promises enhanced heat removal capability using hierarchically-structured surfaces for high heat flux thermal management.

Original languageEnglish (US)
Title of host publication2013 Transducers and Eurosensors XXVII
Subtitle of host publicationThe 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Pages2272-2275
Number of pages4
DOIs
StatePublished - Dec 1 2013
Externally publishedYes
Event2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 - Barcelona, Spain
Duration: Jun 16 2013Jun 20 2013

Publication series

Name2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013

Other

Other2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
CountrySpain
CityBarcelona
Period6/16/136/20/13

Keywords

  • boiling
  • copper oxide
  • critical heat flux
  • hierarchical surface
  • nanostructure
  • surface roughness

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Chu, K. H., Zhu, Y., Miljkovic, N., Nam, Y., Enright, R., & Wang, E. N. (2013). Enhanced boiling heat transfer with copper oxide hierarchical surfaces. In 2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 (pp. 2272-2275). [6627258] (2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013). https://doi.org/10.1109/Transducers.2013.6627258