@inproceedings{b96bf0955ab04e2789adb2a92ef9aa2e,
title = "Enabling large-scale deployment of photonics through cost-efficient and scalable packaging",
abstract = "Enabling single-mode photonic packaging in high-throughput microelectronic equipment can dramatically improve cost and scalability. We experimentally demonstrate such solution using 12-fiber interfaces and flipped-chip lasers. We measure -1.3dB peak fiber-to-chip transmission.",
keywords = "coupling, fiber, packaging, photonics, silicon",
author = "Tymon Barwicz and Yoichi Taira and Lichoulas, {Ted W.} and Nicolas Boyer and Hidetoshi Numata and Yves Martin and Nah, {Jae Woong} and Shotaro Takenobu and Alexander Janta-Polczynski and Kimbrell, {Eddie L.} and Robert Leidy and Marwan Khater and Swetha Kamlapurkar and Sebastian Engelmann and Vlasov, {Yurii A.} and Paul Fortier",
year = "2015",
month = oct,
day = "23",
doi = "10.1109/Group4.2015.7305910",
language = "English (US)",
series = "IEEE International Conference on Group IV Photonics GFP",
publisher = "IEEE Computer Society",
pages = "155--156",
booktitle = "2015 IEEE 12th International Conference on Group IV Photonics, GFP 2015",
note = "12th IEEE International Conference on Group IV Photonics, GFP 2015 ; Conference date: 26-08-2015 Through 28-08-2015",
}