Enabling large-scale deployment of photonics through cost-efficient and scalable packaging

Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Hidetoshi Numata, Yves Martin, Jae Woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, Paul Fortier

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Enabling single-mode photonic packaging in high-throughput microelectronic equipment can dramatically improve cost and scalability. We experimentally demonstrate such solution using 12-fiber interfaces and flipped-chip lasers. We measure -1.3dB peak fiber-to-chip transmission.

Original languageEnglish (US)
Title of host publication2015 IEEE 12th International Conference on Group IV Photonics, GFP 2015
PublisherIEEE Computer Society
Pages155-156
Number of pages2
ISBN (Electronic)9781479982554
DOIs
StatePublished - Oct 23 2015
Externally publishedYes
Event12th IEEE International Conference on Group IV Photonics, GFP 2015 - Vancouver, Canada
Duration: Aug 26 2015Aug 28 2015

Publication series

NameIEEE International Conference on Group IV Photonics GFP
Volume2015-October
ISSN (Print)1949-2081

Other

Other12th IEEE International Conference on Group IV Photonics, GFP 2015
CountryCanada
CityVancouver
Period8/26/158/28/15

Keywords

  • coupling
  • fiber
  • packaging
  • photonics
  • silicon

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Ceramics and Composites
  • Electronic, Optical and Magnetic Materials

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