@inproceedings{b96bf0955ab04e2789adb2a92ef9aa2e,
title = "Enabling large-scale deployment of photonics through cost-efficient and scalable packaging",
abstract = "Enabling single-mode photonic packaging in high-throughput microelectronic equipment can dramatically improve cost and scalability. We experimentally demonstrate such solution using 12-fiber interfaces and flipped-chip lasers. We measure -1.3dB peak fiber-to-chip transmission.",
keywords = "coupling, fiber, packaging, photonics, silicon",
author = "Tymon Barwicz and Yoichi Taira and Lichoulas, {Ted W.} and Nicolas Boyer and Hidetoshi Numata and Yves Martin and Nah, {Jae Woong} and Shotaro Takenobu and Alexander Janta-Polczynski and Kimbrell, {Eddie L.} and Robert Leidy and Marwan Khater and Swetha Kamlapurkar and Sebastian Engelmann and Vlasov, {Yurii A.} and Paul Fortier",
note = "Funding Information: We would like to thank S. Laflamme and Y. Thibodeau for contributing to optical characterization, G. Brouillette for operating the die bonding tool, G. Beaulieu for failure analysis imaging, J. Mailing for valuable discussions, and the staff of the Microelectronic Research Laboratory at the IBM T.J. Watson Research Center for contributing to photonic chip fabrication. Publisher Copyright: {\textcopyright} 2015 IEEE.; 12th IEEE International Conference on Group IV Photonics, GFP 2015 ; Conference date: 26-08-2015 Through 28-08-2015",
year = "2015",
month = oct,
day = "23",
doi = "10.1109/Group4.2015.7305910",
language = "English (US)",
series = "IEEE International Conference on Group IV Photonics GFP",
publisher = "IEEE Computer Society",
pages = "155--156",
booktitle = "2015 IEEE 12th International Conference on Group IV Photonics, GFP 2015",
}