EMI/EMC modeling of packaged electronics: Challenges and opportunities

Andreas C Cangellaris, Johannes Russer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The complexity of EMI/EMC modeling at the package, board and system level of multifunctional electronic designs necessitates the use of approximations in the development of a manageable computer model. Such approximations can be interpreted in terms of geometric, material, and layout variability. This variability, which is also relevant to uncertainties in floor-planning, layout and operating conditions, calls for methodologies and tools for predictive component and system EM performance and functionality assessment in the presence of uncertainty. Such modeling capability is not available today. This paper explores the opportunities for and potential benefits from the development of such modeling capability in support of EMI/EMC modeling for noise-aware computer-aided integration of multi-functional electronic systems.

Original languageEnglish (US)
Title of host publication2011 30th URSI General Assembly and Scientific Symposium, URSIGASS 2011
DOIs
StatePublished - 2011
Event2011 30th URSI General Assembly and Scientific Symposium, URSIGASS 2011 - Istanbul, Turkey
Duration: Aug 13 2011Aug 20 2011

Other

Other2011 30th URSI General Assembly and Scientific Symposium, URSIGASS 2011
CountryTurkey
CityIstanbul
Period8/13/118/20/11

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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