EM education in relation to VLSI electronic packaging and interconnects

A. C. Cangellaris, J. L. Prince, O. A. Palusinski

Research output: Contribution to journalConference articlepeer-review


Electromagnetic (EM) education in the context of modern VLSI packaging and interconnection analysis is considered, and some thoughts on how an introductory electromagnetics course may be structured on the basis of the specific problems associated with VLSI interconnections analysis are presented. It is shown how such a course could be upgraded to a senior-level or introductory graduate-level course for students who have already had a one-semester course in basic electromagnetic wave theory.

Original languageEnglish (US)
Pages (from-to)1675-1677
Number of pages3
JournalIEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
StatePublished - 1990
Externally publishedYes
Event1990 Antennas and Propagation Symposium Digest - Dallas, TX, USA
Duration: May 7 1990May 11 1990

ASJC Scopus subject areas

  • Electrical and Electronic Engineering


Dive into the research topics of 'EM education in relation to VLSI electronic packaging and interconnects'. Together they form a unique fingerprint.

Cite this