Ellipsometry studies of (μc-Si:H/ZnO) and (μc-Si:H/a-Si:H) interfaces in magnetron sputtering system

Y. H. Yang, M. Katiyar, J. R. Abelson, N. Maley

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We have studied the microstructure of μc-Si:H/ZnO and μc-Si:H/a-Si:H interfaces in reactive magnetron sputtering (RMS) using in situ spectroscopic ellipsometry (SE). For μc-Si:H deposited on ZnO, the real time ellipsometry trajectory shows that there is 20 volume% void apparent inside the first 100 angstroms film. Then the film becomes densified, the initial void layer propagates as a surface layer, and its thickness decreases to 53 angstroms when the bulk film reaches 200 angstroms. Both unhydrogenated and hydrogenated silicon films deposited on ZnO show similar nucleation and coalescence behavior. This indicates that the atomic hydrogen rich plasma under μc-Si growth conditions doesn't reduce the ZnO substrate. For the μc-Si:H/a-Si:H study, we also observe the delayed crystallite nucleation after a approximately 100 angstroms high H content interface layer forms. Part of this layer results from H implanted into the a-Si:H substrate (approximately 45 angstroms deep). The thickness of this interface layer decreases as the crystallite nucleation begins. This is the first direct experimental evidence showing sub-surface μc-Si:H formation.

Original languageEnglish (US)
Title of host publicationAmorphous Silicon Technology
PublisherPubl by Materials Research Society
Pages25-30
Number of pages6
ISBN (Print)155899193X, 9781558991934
DOIs
StatePublished - 1993
EventProceedings of the MRS Spring Meeting - San Francisco, CA, USA
Duration: Apr 13 1993Apr 16 1993

Publication series

NameMaterials Research Society Symposium Proceedings
Volume297
ISSN (Print)0272-9172

Other

OtherProceedings of the MRS Spring Meeting
CitySan Francisco, CA, USA
Period4/13/934/16/93

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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