Electromagnetics-thermal co-analysis of real-life 3-D ICs using non-conformal domain decomposition method

Yang Shao, Zhen Peng, Jin Fa Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Advances in integrated circuit (IC) and package technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for faster speed and higher performance in today's electronic products. However, continuing down-scaling in feature size poses crucial issues, such as the parasitic couplings between circuit elements and localized Joule heat dissipation. In this work, we introduce a systematic computational Electromagnetic (CEM)-thermal coupling approach capable of dealing with multiscale problems such as 3-D ICs and subsystems. A non-conformal finite element domain decomposition method is utilized to iterative the electrostatic, full-wave electromagnetic and thermal simulation. Moreover, we included preliminary numerical results demonstrating the effectiveness of the proposed approach.

Original languageEnglish (US)
Title of host publicationEMC 2011 - Proceedings
Subtitle of host publication2011 IEEE International Symposium on Electromagnetic Compatibility
Pages237-242
Number of pages6
DOIs
StatePublished - Oct 24 2011
Externally publishedYes
Event2011 IEEE International Symposium on Electromagnetic Compatibility, EMC 2011 - Long Beach, CA, United States
Duration: Aug 14 2011Aug 19 2011

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076

Conference

Conference2011 IEEE International Symposium on Electromagnetic Compatibility, EMC 2011
CountryUnited States
CityLong Beach, CA
Period8/14/118/19/11

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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