TY - GEN
T1 - Electromagnetics-thermal co-analysis of real-life 3-D ICs using non-conformal domain decomposition method
AU - Shao, Yang
AU - Peng, Zhen
AU - Lee, Jin Fa
PY - 2011/10/24
Y1 - 2011/10/24
N2 - Advances in integrated circuit (IC) and package technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for faster speed and higher performance in today's electronic products. However, continuing down-scaling in feature size poses crucial issues, such as the parasitic couplings between circuit elements and localized Joule heat dissipation. In this work, we introduce a systematic computational Electromagnetic (CEM)-thermal coupling approach capable of dealing with multiscale problems such as 3-D ICs and subsystems. A non-conformal finite element domain decomposition method is utilized to iterative the electrostatic, full-wave electromagnetic and thermal simulation. Moreover, we included preliminary numerical results demonstrating the effectiveness of the proposed approach.
AB - Advances in integrated circuit (IC) and package technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for faster speed and higher performance in today's electronic products. However, continuing down-scaling in feature size poses crucial issues, such as the parasitic couplings between circuit elements and localized Joule heat dissipation. In this work, we introduce a systematic computational Electromagnetic (CEM)-thermal coupling approach capable of dealing with multiscale problems such as 3-D ICs and subsystems. A non-conformal finite element domain decomposition method is utilized to iterative the electrostatic, full-wave electromagnetic and thermal simulation. Moreover, we included preliminary numerical results demonstrating the effectiveness of the proposed approach.
UR - http://www.scopus.com/inward/record.url?scp=80054723920&partnerID=8YFLogxK
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U2 - 10.1109/ISEMC.2011.6038316
DO - 10.1109/ISEMC.2011.6038316
M3 - Conference contribution
AN - SCOPUS:80054723920
SN - 9781424447831
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 237
EP - 242
BT - EMC 2011 - Proceedings
T2 - 2011 IEEE International Symposium on Electromagnetic Compatibility, EMC 2011
Y2 - 14 August 2011 through 19 August 2011
ER -