Electroless deposition of highly solderable Fe-Ni films

Haifei Zhou, Jingdong Guo, Jianku Shang

Research output: Contribution to journalArticlepeer-review

Abstract

The simultaneous electroless-deposition of Fe and Ni is challenging because Fe has a more negative standard reduction potential than Ni. In this study, FeNiP electroless deposits with Fe content up to 97 at.% were prepared by complexing with disodium ethylene diamine tetraacetate (EDTA-2Na). The addition of ETDA-2Na complexing agent effectively reduced the difference in the electrode potential between Ni and Fe from 0.21 V to 0.156 V, resulting in Fe-Ni depositions with very high Fe concentrations. The iron concentrations of deposited films were systematically investigated as functions of bath temperature, concentrations of EDTA-2Na and DTPA, mole ratio of Fe 2+/Ni2+ and contents of NH3·H 2O in the plating bath. The solderability of electroless FeNiP deposits with Sn and SnAgCu solders was found to increase with the iron content in the deposits from 0 at.% to 85 at.%, and to be better than that of the electroless NiP.

Original languageEnglish (US)
Pages (from-to)D233-D239
JournalJournal of the Electrochemical Society
Volume160
Issue number6
DOIs
StatePublished - Sep 24 2013

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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