Electrodeposition of Copper: The Effect of Various Organic Compounds

Richard C. Alkire, Elias D. Eliadis

Research output: Contribution to journalArticlepeer-review


Electrodeposition of copper in the presence of organic additives is discussed from the point of view that technological applications require an understanding of fundamental phenomena over a wide range of length scales that are important simultaneously. Examples of recent advances in experimental techniques, namely digital atomic force microscopy and confocal laser scanning fluorescence microscopy, are discussed to illustrate that quantitative procedures for characterizing behavior are advancing rapidly in the range between the wavelength of light and the atomic scale. Examples of these methods to investigate the role of organic compounds (benzotriazole, thiourea, alkanethiols, quaternary ammonium salts, and electro-active fluorescent dyes) on nucleation and propagation of copper electrodeposits on a variety of substrates are described. These events point to the growing importance of incorporating new understanding of surface films and lattice formation events into mathematical models suitable for use in engineering design and control.

Original languageEnglish (US)
Pages (from-to)1-15
Number of pages15
JournalZeitschrift fur Physikalische Chemie
Issue numberPart_1_2
StatePublished - Jan 1999

ASJC Scopus subject areas

  • Physical and Theoretical Chemistry


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