Electroconductive oxide ceramics with graphene-encapsulated fillers

I. Hussainova, M. Drozdova, R. Ivanov, S. Kale, Iwona M Jasiuk

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A single-step catalyst-free CVD technique has been used for producing an array of mullite nanofibers covered by several layers of graphene-like nanostructures. The hybrid fibers have been then exploited as electroconductive fillers to alumina and yttria stabilized zirconia matrixes. The electrically conductive additives do not substantially change the mechanical properties. However, the resistivity of the composites undergoes a considerable drop turning the dielectric oxides into conductive composites by addition of 2 vol% of fillers which corresponds to 0.2 and 0.38 vol% of carbon content in alumina and zirconia, respectively. Three-dimensional Monte Carlo simulation of systems, exploiting the critical path based tunnelling-percolation model, gives a tunnelling length-scale of 2.23 nm for the materials under consideration.

Original languageEnglish (US)
Title of host publicationCeramic Engineering and Science Proceedings
EditorsPeter Mechnich, Dietmar Koch, Mihails Kusnezoff, Jerry LaSalvia, Jonathan Salem, Palani Balaya, Zhengyi Fu, Narottam Bansal, Tatsuki Ohji
PublisherAmerican Ceramic Society
Pages251-258
Number of pages8
Edition2
ISBN (Print)9781119040439
StatePublished - Jan 1 2019
Event42nd International Conference on Advanced Ceramics and Composites, ICACC 2018 - Daytona Beach, United States
Duration: Jan 21 2018Jan 26 2018

Publication series

NameCeramic Engineering and Science Proceedings
Number2
Volume39
ISSN (Print)0196-6219

Conference

Conference42nd International Conference on Advanced Ceramics and Composites, ICACC 2018
CountryUnited States
CityDaytona Beach
Period1/21/181/26/18

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ASJC Scopus subject areas

  • Ceramics and Composites
  • Materials Chemistry

Cite this

Hussainova, I., Drozdova, M., Ivanov, R., Kale, S., & Jasiuk, I. M. (2019). Electroconductive oxide ceramics with graphene-encapsulated fillers. In P. Mechnich, D. Koch, M. Kusnezoff, J. LaSalvia, J. Salem, P. Balaya, Z. Fu, N. Bansal, & T. Ohji (Eds.), Ceramic Engineering and Science Proceedings (2 ed., pp. 251-258). (Ceramic Engineering and Science Proceedings; Vol. 39, No. 2). American Ceramic Society.