Electrochemical imprinting of micro- and nano-structures in porous silicon, silicon, and other semiconductors

Keng Hao Hsu; Bruno Azeredo; Placid M Ferreira

Electrochemical imprinting of micro- and nano-structures in porous silicon, silicon, and other semiconductors

Keng Hao Hsu (Inventor), Bruno Azeredo (Inventor), Placid M Ferreira (Inventor)

Research output: Patent

Abstract

An imprinting platform including a noble metal catalyst, a semiconductor substrate, and a pre-patterned polymer stamp, where the catalyst is attached to the stamp, and related methods and articles.

Original language	English (US)
U.S. patent number	11579524
Filing date	11/3/21
State	Published - Feb 14 2023

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title = "Electrochemical imprinting of micro- and nano-structures in porous silicon, silicon, and other semiconductors",

abstract = "An imprinting platform including a noble metal catalyst, a semiconductor substrate, and a pre-patterned polymer stamp, where the catalyst is attached to the stamp, and related methods and articles.",

author = "Hsu, {Keng Hao} and Bruno Azeredo and Ferreira, {Placid M}",

year = "2023",

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day = "14",

language = "English (US)",

type = "Patent",

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T1 - Electrochemical imprinting of micro- and nano-structures in porous silicon, silicon, and other semiconductors

AU - Hsu, Keng Hao

AU - Azeredo, Bruno

AU - Ferreira, Placid M

PY - 2023/2/14

Y1 - 2023/2/14

N2 - An imprinting platform including a noble metal catalyst, a semiconductor substrate, and a pre-patterned polymer stamp, where the catalyst is attached to the stamp, and related methods and articles.

AB - An imprinting platform including a noble metal catalyst, a semiconductor substrate, and a pre-patterned polymer stamp, where the catalyst is attached to the stamp, and related methods and articles.

M3 - Patent

M1 - 11579524

Y2 - 2021/11/03

ER -

Electrochemical imprinting of micro- and nano-structures in porous silicon, silicon, and other semiconductors

Abstract

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