TY - GEN
T1 - Electro-thermal Trade-off for AC-Current Injection & Series-Clamping-Diodes Based Rds-on Estimation Circuit
AU - Karakaya, Furkan
AU - Maheshwari, Anuj
AU - Banerjee, Arijit
AU - Donnal, John S.
N1 - This work was funded by the Office of Naval Research MVDC Risk Reduction program under Grant Numbers N000142112277, N0001418WX01706 and N000141812889. It is approved for public release with unlimited distribution (DCN 543-1157-23).
PY - 2024
Y1 - 2024
N2 - Series double diode (SDD) configuration with ac current injection allows online estimation of on-state resistance without the need for current measurement. However, challenges arise from the high-frequency ac current injection, which requires minimizing the ac current-loop inductance while maintaining thermal balance among the diodes. Experimental results demonstrate the negative impact of poor thermal or electrical design on measurement accuracy. Therefore, this paper investigates the trade-off between the ac current-loop inductance and diode-temperature balance in the electro-thermal design of an SDD configuration for power-device health monitoring. The study emphasizes the need for an optimized electro-thermal design to achieve accurate monitoring and estimation of power device parameters.
AB - Series double diode (SDD) configuration with ac current injection allows online estimation of on-state resistance without the need for current measurement. However, challenges arise from the high-frequency ac current injection, which requires minimizing the ac current-loop inductance while maintaining thermal balance among the diodes. Experimental results demonstrate the negative impact of poor thermal or electrical design on measurement accuracy. Therefore, this paper investigates the trade-off between the ac current-loop inductance and diode-temperature balance in the electro-thermal design of an SDD configuration for power-device health monitoring. The study emphasizes the need for an optimized electro-thermal design to achieve accurate monitoring and estimation of power device parameters.
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U2 - 10.1109/APEC48139.2024.10509041
DO - 10.1109/APEC48139.2024.10509041
M3 - Conference contribution
AN - SCOPUS:85192704775
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 1095
EP - 1099
BT - 2024 IEEE Applied Power Electronics Conference and Exposition, APEC 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 39th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2024
Y2 - 25 February 2024 through 29 February 2024
ER -