Abstract
In the road-line map of the lead-free soldering for electronic packaging, the development and application of the lead-free solder coating on Cu matrix is a key step. An alkaline pyrophosphate bath and electroplating processing is developed for a Sn-Ag lead-free solder coating. The research results are focused at effects of the bath composition and the processing parameters on silver content and morphology of the coating, the processing parameters include cathodic current density, bath temperature and agitation.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 822-826 |
| Number of pages | 5 |
| Journal | Jinshu Xuebao/Acta Metallurgica Sinica |
| Volume | 40 |
| Issue number | 8 |
| State | Published - Aug 2004 |
| Externally published | Yes |
Keywords
- Electroplating
- Lead-free solder
- Microelectronic packaging
- Sn-Ag alloy
ASJC Scopus subject areas
- Geotechnical Engineering and Engineering Geology
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys