Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath

Mu Qiao, Aiping Xian, Jianku Shang

Research output: Contribution to journalArticle

Abstract

In the road-line map of the lead-free soldering for electronic packaging, the development and application of the lead-free solder coating on Cu matrix is a key step. An alkaline pyrophosphate bath and electroplating processing is developed for a Sn-Ag lead-free solder coating. The research results are focused at effects of the bath composition and the processing parameters on silver content and morphology of the coating, the processing parameters include cathodic current density, bath temperature and agitation.

Original languageEnglish (US)
Pages (from-to)822-826
Number of pages5
JournalJinshu Xuebao/Acta Metallurgica Sinica
Volume40
Issue number8
StatePublished - Aug 1 2004

Keywords

  • Electroplating
  • Lead-free solder
  • Microelectronic packaging
  • Sn-Ag alloy

ASJC Scopus subject areas

  • Geotechnical Engineering and Engineering Geology
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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