@inproceedings{a9429349af224ee7ba76d80a4271c288,
title = "Electrical-thermal co-simulation for through silicon via and active tier in 3-D IC",
abstract = "An electrical-thermal co-simulation method for through silicon via (TSV) and active tier in 3-D IC is presented in this paper. Based on the thermal-electrical analogy, both steady and transient co-simulation can be performed in frequently-used circuit solver. Accuracy and efficiency of the proposed method are demonstrated by numerical examples, which also show that active tiers have a greater effect on the whole thermal performance.",
author = "Qiu Min and Zhou, \{Shi Yun\} and Cheng Zhuo and Jin, \{Jian Ming\} and Li, \{Er Ping\}",
note = "This work was partially supported by the National Natural Science Foundation of China under Grant No. 61371031 and 61571395, and by the Fundamental Research Funds for the Central Universities under Grant No. 2017XZZX009.; 60th IEEE International Symposium on Electromagnetic Compatibility and 9th IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 ; Conference date: 14-05-2018 Through 18-05-2018",
year = "2018",
month = jun,
day = "22",
doi = "10.1109/ISEMC.2018.8394076",
language = "English (US)",
series = "2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "110",
booktitle = "2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018",
address = "United States",
}