@inproceedings{a9429349af224ee7ba76d80a4271c288,
title = "Electrical-thermal co-simulation for through silicon via and active tier in 3-D IC",
abstract = "An electrical-thermal co-simulation method for through silicon via (TSV) and active tier in 3-D IC is presented in this paper. Based on the thermal-electrical analogy, both steady and transient co-simulation can be performed in frequently-used circuit solver. Accuracy and efficiency of the proposed method are demonstrated by numerical examples, which also show that active tiers have a greater effect on the whole thermal performance.",
author = "Qiu Min and Zhou, {Shi Yun} and Cheng Zhuo and Jin, {Jian Ming} and Li, {Er Ping}",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 60th IEEE International Symposium on Electromagnetic Compatibility and 9th IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 ; Conference date: 14-05-2018 Through 18-05-2018",
year = "2018",
month = jun,
day = "22",
doi = "10.1109/ISEMC.2018.8394076",
language = "English (US)",
series = "2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "110",
booktitle = "2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018",
address = "United States",
}