Electrical-thermal co-simulation for large-scale analysis of integrated circuits

Tianjian Lu, Jian Ming Jin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An electrical-thermal co-simulation is presented for analysis of integrated circuits. The co-simulation addresses a wide range of situations where strong interactions between electrical designs and thermal issues have to be properly accounted. The capability of the co-simulation is extended to deal with large-scale problems by incorporating a domain decomposition scheme, parallel computing, and an adaptive time-stepping scheme. Numerical examples are provided to demonstrate the capability and efficiency of the co-simulation.

Original languageEnglish (US)
Title of host publicationProceedings of 2015 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization, NEMO 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479968114
DOIs
StatePublished - Feb 19 2016
EventIEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization, NEMO 2015 - Ottawa, Canada
Duration: Aug 11 2015Aug 14 2015

Publication series

NameProceedings of 2015 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization, NEMO 2015

Other

OtherIEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization, NEMO 2015
Country/TerritoryCanada
CityOttawa
Period8/11/158/14/15

Keywords

  • Electrical-thermal co-simulation
  • domain decomposition
  • finite element method
  • integrated circuits

ASJC Scopus subject areas

  • Radiation
  • Numerical Analysis
  • Electrical and Electronic Engineering
  • Control and Optimization
  • Modeling and Simulation

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