Abstract
For accurate DC IR-drop analysis of integrated circuits, electrical-thermal co-simulation is necessary to consider the effect of Joule heating. A suitable numerical method for this co-simulation is the finite element method (FEM) because of its capabilities in modeling complex geometries and materials. To deal with large-scale problems, a domain decomposition scheme is applied to the FEM to enable simulation with multiple processors in parallel and achieve significant reduction in computation time.
| Original language | English (US) |
|---|---|
| Article number | 6578141 |
| Pages (from-to) | 323-331 |
| Number of pages | 9 |
| Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Volume | 4 |
| Issue number | 2 |
| DOIs | |
| State | Published - Feb 2014 |
Keywords
- Electrical-thermal co-simulation
- finite element method
- finite element tearing and interconnecting
- on-chip power grid
- parallel computing
- power delivery
- through silicon vias (TSVs)
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering