Electrical-thermal co-simulation for DC IR-drop analysis of large-scale power delivery

Tianjian Lu, Jian Ming Jin

Research output: Contribution to journalArticlepeer-review


For accurate DC IR-drop analysis of integrated circuits, electrical-thermal co-simulation is necessary to consider the effect of Joule heating. A suitable numerical method for this co-simulation is the finite element method (FEM) because of its capabilities in modeling complex geometries and materials. To deal with large-scale problems, a domain decomposition scheme is applied to the FEM to enable simulation with multiple processors in parallel and achieve significant reduction in computation time.

Original languageEnglish (US)
Article number6578141
Pages (from-to)323-331
Number of pages9
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number2
StatePublished - Feb 2014


  • Electrical-thermal co-simulation
  • finite element method
  • finite element tearing and interconnecting
  • on-chip power grid
  • parallel computing
  • power delivery
  • through silicon vias (TSVs)

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering


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